参数资料
型号: KMPC8560PX667LB
厂商: Freescale Semiconductor
文件页数: 31/36页
文件大小: 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
标准包装: 2
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 667MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 784-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
4
MPC8560 PowerQUICC III
MOTOROLA
Integrated Communications Processor Product Brief
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Key Features
— Time-slot assigner (TSA) supports multiplexing of data from any of the SCCs and FCCs onto
eight time-division multiplexed (TDM) interfaces. The time-slot assigner supports the
following TDM formats:
– T1/CEPT lines
–T3/E3
– Pulse code modulation (PCM) highway interface
– ISDN primary rate
– Motorola interchip digital link (IDL)
– General circuit interface (GCI)
— User-defined interfaces
— Eight independent baud rate generators (BRGs)
— Four general-purpose 16-bit timers or two 32-bit timers
— General-purpose parallel ports—16 parallel I/O lines with interrupt capability
— Supports inverse muxing of ATM cells (IMA)
256-Kbyte L2 cache/SRAM
— Can be configured as follows:
– Full cache mode (256-Kbyte cache)
– Full memory-mapped SRAM mode (256-Kbyte SRAM mapped as a single 256-Kbyte block
or two 128-Kbyte blocks)
– Half SRAM and half cache mode (128-Kbyte cache and 128-Kbyte memory-mapped
SRAM)
— Full error checking and correction (ECC) support on 64-bit boundary in both cache and SRAM
modes
— Cache mode supports instruction caching, data caching, or both
— External masters can force data to be allocated into the cache through programmed memory
ranges or special transaction types (stashing).
— Eight-way set-associative cache organization (1024 sets of 32-byte cache lines)
— Supports locking the entire cache or selected lines. Individual line locks are set and cleared
through Book E instructions or by externally mastered transactions.
— Global locking and flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be flash cleared separately
— Read and write buffering for internal bus accesses
— SRAM features include the following:
– I/O devices access SRAM regions by marking transactions as snoopable (global).
– Regions can reside at any aligned location in the memory map.
– Byte-accessible ECC is protected using read-modify-write transactions accesses for smaller
than cache-line accesses
Address translation and mapping unit (ATMU)
— Eight local access windows define mapping within local 32-bit address space
— Inbound and outbound ATMUs map to larger external address spaces
– Three inbound windows plus a configuration window on PCI/PCI-X
– Four inbound windows plus a default and configuration window on RapidIO
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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KMPC8560PX667LC 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8560PX833LB 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8560PX833LC 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8560PXAQFB 功能描述:微处理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8560VT667LB 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324