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参数资料
| 型号： | LM9823CCWM/NOPB |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO28 |
| 封装： | 0.300 INCH, PLASTIC, SOIC-28 |
| 文件页数： | 18/22页 |
| 文件大小： | 238K |
| 代理商： | LM9823CCWM/NOPB |
5
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AC Electrical Characteristics
The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz, except where noted
otherwise. Boldface limits apply for TA=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7& 8)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional,
but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND=AGND=DGND=0V, unless otherwise specified.
Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN<GND or VIN>VA or VD), the current at that pin should be limited to 25mA. The 50mA max-
imum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25mA to two.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, ΘJA and the ambient temperature, TA. The maximum allow-
able power dissipation at any temperature is PD = (TJmax - TA) / ΘJA. TJmax = 150°C for this device. The typical thermal resistance (ΘJA) of this part when board mounted
is 69°C/W for the M28B SOIC package
.
Note 5: Human body model, 100pF capacitor discharged through a 1.5k
resistor. Machine model, 200 pF capacitor discharged through a 0 resistor.
Note 6: See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any National Semiconductor Linear
Data Book for other methods of soldering surface mount devices.
Power Supply Characteristics
IA
Analog Supply Current
Operating
75
108
mA (max)
Power Down
675
900
A (max)
ID
Digital Supply Current (Note 15)
Operating
210
475
A (max)
Power Down
2
25
A (max)
Symbol
Parameter
Conditions
Typical
(Note 9)
Limits
(Note 10)
Units
(Limits)
fMCLK
Maximum MCLK frequency
12
MHz (min)
tMCLK
MCLK period
83
ns (min)
MCLK duty cycle
40
60
%(min)
%(max)
tSCLK
Serial Clock Period
1
tMCLK(min)
tSEN
Serial Enable high time
3
tMCLK(min)
tSSU
SDI setup time
1
ns (min)
tSH
SDI hold time
3
ns (min)
tSDDO
SCLK
edge to new valid data
VD = 5.0V
VD = 3.3V
8.5
19
20
ns (max)
tVSU
VSMP setup time
1
ns (min)
tVH
VSMP hold time
3
ns (min)
tCSU
CLMP setup time
1
ns (min)
tCH
CLMP hold time
3
ns (min)
tDDO
MCLK
edge to new valid data
VD = 5.0V
VD = 3.3V
16
25
25
ns (max)
DC and Logic Electrical Characteristics (Continued)
The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz. Boldface limits apply
for TA=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7 & 8)
Symbol
Parameter
Conditions
Typical
(Note 9)
Limits
(Note 10)
Units
(Limits)
L
M
9
823
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