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参数资料
| 型号： | LMH6734MQX/NOPB |
| 厂商： | National Semiconductor |
| 文件页数： | 10/21页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER TRPL SELECT 16-SSOP |
| 标准包装： | 2,500 |
| 系列： | PowerWise® |
| 应用： | 电流反馈 |
| 电路数： | 3 |
| -3db带宽： | 925MHz |
| 转换速率： | 3750 V/µs |
| 电流 - 电源： | 19.5mA |
| 电流 - 输出 / 通道： | 80mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 12 V，±1.5 V ~ 6 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-LSSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-QSOP |
| 包装： | 带卷 (TR) |
| 配用： | LMH730275/NOPB-ND - EVAL BOARD HS TRIPLE SSOP OPAMP |
| 其它名称： | LMH6734MQX |
OBSOLETE
SNOSAY0C – JUNE 2007 – REVISED APRIL 2013
VIDEO PERFORMANCE
The LMH6734 has been designed to provide excellent performance with production quality video signals in a
wide variety of formats such as HDTV and High Resolution VGA. NTSC and PAL performance is nearly flawless.
Best performance will be obtained with back terminated loads. The back termination reduces reflections from the
transmission line and effectively masks transmission line and other parasitic capacitances from the amplifier
output stage. Figure 41 shows a typical configuration for driving a 75
cable. The amplifier is configured for a
gain of two to make up for the 6 dB of loss in ROUT.
POWER DISSIPATION
The LMH6734 is optimized for maximum speed and performance in the small form factor of the standard 16-Pin
SSOP package. To achieve its high level of performance, the LMH6734 consumes an appreciable amount of
quiescent current which cannot be neglected when considering the total package power dissipation limit. The
quiescent current contributes to about 40° C rise in junction temperature when no additional heat sink is used (VS
= ±5V, all three channels on). Therefore, it is easy to see the need for proper precautions in order to make sure
the junction temperature’s absolute maximum rating of 150°C is not violated.
To ensure maximum output drive and highest performance, thermal shutdown is not provided. Therefore, it is of
utmost importance to make sure that the TJMAX is never exceeded due to the overall power dissipation (all three
channels).
With the LMH6734 used in a back-terminated 75
RGB analog video system (with 2 VPP output voltage), the
total power dissipation is around 305 mW of which 220 mW is due to the quiescent device dissipation (output
black level at 0V). With no additional heat sink used, the junction temperature rises to about 120°C when
operated at 85°C ambient.
To reduce the junction temperature many options are available. Forced air cooling is the easiest option. An
external add-on heat-sink can be added to the 16-Pin SSOP package, or alternatively, additional board metal
(copper) area can be utilized as heat-sink.
An effective way to reduce the junction temperature for the 16-Pin SSOP package (and other plastic packages) is
to use the copper board area to conduct heat. With no enhancement the major heat flow path in this package is
from the die through the metal lead frame (inside the package) and onto the surrounding copper through the
interconnecting leads. Since high frequency performance requires limited metal near the device pins the best
way to use board copper to remove heat is through the bottom of the package. A gap filler with high thermal
conductivity can be used to conduct heat from the bottom of the package to copper on the circuit board. Vias to a
ground or power plane on the back side of the circuit board will provide additional heat dissipation. A combination
of front side copper and vias to the back side can be combined as well.
Follow these steps to determine the maximum power dissipation for the LMH6734:
1. Calculate the quiescent (no-load) power: PAMP = ICC X (VS) VS = V
+-V
2. Calculate the RMS power dissipated in the output stage:
–
PD (rms) = rms ((VS - VOUT) X IOUT) where VOUT and IOUT are the voltage and current across the external
load and VS is the total supply current
3. Calculate the total RMS power: PT = PAMP+PD
The maximum power that the LMH6734 package can dissipate at a given temperature (See Figure 48) can be
derived with the following equation:
PMAX = (150° C/W – TAMB)/ θJA, where TAMB = Ambient temperature (°C) and θJA = Thermal resistance, from
junction to ambient, for a given package (°C/W). For the SSOP package
θJA is 120°C/W.
18
Copyright 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH6734
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LMH6738 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:Very Wideband, Low Distortion Triple Op Amp |
| LMH6738MQ | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LMH6738MQ/NOPB | 功能描述:运算放大器 - 运放 Triple Video Op-Amp RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LMH6738MQX | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LMH6738MQX/NOPB | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
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