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| 型号： | LP3875EMP-ADJ/NOPB |
| 厂商： | National Semiconductor |
| 文件页数： | 11/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 1.5A SOT223-5 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 2.5 V ~ 7 V |
| 电压 - 压降（标准）： | 0.38V @ 1.5A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1.5A（最小值） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-261-5，TO-261AB |
| 供应商设备封装： | SOT-223-5 |
| 包装： | 标准包装 |
| 产品目录页面： | 1292 (CN2011-ZH PDF) |
| 其它名称： | LP3875EMP-ADJDKR |
SNVS247D – SEPTEMBER 2003 – REVISED APRIL 2013
In this equation, θ CH is the thermal resistance from the case to the surface of the heat sink and θ JC is the thermal
resistance from the junction to the surface of the case. θ JC is about 3°C/W for a TO-220 package. The value for
θ CH depends on method of attachment, insulator, etc. θ CH varies between 1.5°C/W to 2.5°C/W. If the exact value
is unknown, 2°C/W can be assumed.
HEATSINKING DDPAK/TO-263 PACKAGE
The DDPAK/TO-263 package uses the copper plane on the PCB as a heatsink. The tab of these packages are
soldered to the copper plane for heat sinking. Figure 17 shows a curve for the θ JA of DDPAK/TO-263 package for
different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area
for heat sinking.
Figure 17. θ JA vs Copper (1 Ounce) Area for DDPAK/TO-263 Package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The
minimum value for θ JA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.
Figure 18 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient
temperatures, assuming θ JA is 35°C/W and the maximum junction temperature is 125°C.
Figure 18. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 Package
HEATSINKING SOT-223-5 PACKAGE
Figure 19 shows a curve for the θ JA of SOT-223 package for different copper area sizes, using a typical PCB with
1 ounce copper and no solder mask over the copper area for heat sinking.
Copyright ? 2003–2013, Texas Instruments Incorporated
Product Folder Links: LP3875-ADJ
11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LP3875EMPX-1.8 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:1.5A Fast Ultra Low Dropout Linear Regulators |
| LP3875EMPX-1.8/NOPB | 功能描述:IC REG LDO 1.8V 1.5A SOT223-5 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.1V 输入电压:最高 5.5V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA 电流 - 限制（最小）:420mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
| LP3875EMPX-2.5 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:1.5A Fast Ultra Low Dropout Linear Regulators |
| LP3875EMPX-2.5/NOPB | 功能描述:IC REG LDO 2.5V 1.5A SOT223-5 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.1V 输入电压:最高 5.5V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA 电流 - 限制（最小）:420mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
| LP3875EMPX-3.3 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:1.5A Fast Ultra Low Dropout Linear Regulators |
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