参数资料
型号: LP3875EMP-ADJ/NOPB
厂商: National Semiconductor
文件页数: 14/20页
文件大小: 0K
描述: IC REG LDO ADJ 1.5A SOT223-5
标准包装: 1
稳压器拓扑结构: 正,可调式
输出电压: 可调
输入电压: 2.5 V ~ 7 V
电压 - 压降(标准): 0.38V @ 1.5A
稳压器数量: 1
电流 - 输出: 1.5A(最小值)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-261-5,TO-261AB
供应商设备封装: SOT-223-5
包装: 标准包装
产品目录页面: 1292 (CN2011-ZH PDF)
其它名称: LP3875EMP-ADJDKR
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
1-Nov-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
LP3875EMP-ADJ/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
CU SN
Level-1-260C-UNLIM
-40 to 125
LHSB
& no Sb/Br)
LP3875EMPX-ADJ/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
CU SN
Level-1-260C-UNLIM
-40 to 125
LHSB
& no Sb/Br)
LP3875ES-ADJ
NRND
DDPAK/
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3875ES
TO-263
ADJ
LP3875ES-ADJ/NOPB
ACTIVE
DDPAK/
KTT
5
45
Pb-Free (RoHS
CU SN
Level-3-245C-168 HR
-40 to 125
LP3875ES
TO-263
Exempt)
ADJ
LP3875ESX-ADJ/NOPB
ACTIVE
DDPAK/
KTT
5
500
Pb-Free (RoHS
CU SN
Level-3-245C-168 HR
-40 to 125
LP3875ES
(1)
TO-263
The marketing status values are defined as follows:
Exempt)
ADJ
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
(4)
(5)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
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