参数资料
型号: LT3686HDD#TRPBF
厂商: Linear Technology
文件页数: 23/28页
文件大小: 0K
描述: IC REG BUCK ADJ 1.2A 10DFN
标准包装: 2,500
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.8 V ~ 30 V
输入电压: 3.6 V ~ 37 V
PWM 型: 电流模式
频率 - 开关: 300kHz ~ 2.5MHz
电流 - 输出: 1.2A
同步整流器:
工作温度: -40°C ~ 150°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 10-DFN(3x3)
LT3686
APPLICATIONS INFORMATION
PCB Layout
For proper operation and minimum EMI, care must be taken
during printed circuit board layout. Figure 17 shows the
recommended component placement with trace, ground
plane and via locations. Note that large, switched currents
flow in the LT3686’s V IN and SW pins, the catch diode (D1)
and the input capacitor (C2). The loop formed by these
components should be as small as possible and tied to
system ground in only one place. These components,
along with the inductor and output capacitor, should be
placed on the same side of the circuit board, and their
connections should be made on that layer. Place a local,
unbroken ground plane below these components, and
tie this ground plane to system ground at one location,
OUT
ideally at the ground terminal of the output capacitor C1.
The SW and BOOST nodes should be as small as possible.
Finally, keep the FB node small so that the ground pin and
ground traces will shield it from the SW and BOOST nodes.
Include vias near the exposed GND pad of the LT3686 to
help remove heat from the LT3686 to the ground plane.
High Temperature Considerations
The die temperature of the LT3686E/I must be lower than
the maximum rating of 125°C (150°C for the LT3686H).
For high ambient temperatures, care should be taken in
the layout of the circuit to ensure good heat sinking of the
LT3686. The maximum load current should be derated as
the ambient temperature approaches the maximum allowed
C2
SW
D1
FB
BD
V IN
SS
RT
UVLO
DA
MODE
BST
3686 F17
Figure 17. PCB Layout
3686fc
23
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