参数资料
型号: LT3724IFE#PBF
厂商: Linear Technology
文件页数: 24/26页
文件大小: 0K
描述: IC REG CTRLR BST INV PWM 16TSSOP
标准包装: 95
PWM 型: 电流模式
输出数: 1
频率 - 最大: 225kHz
占空比: 100%
电源电压: 4 V ~ 60 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 16-TSSOP(0.173",4.40mm)裸露焊盘
包装: 管件
LT3724
PACKAGE DESCRIPTION
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev I)
Exposed Pad Variation BC
3.58
(.141)
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
16 1514 13 12 11
10 9
0.48
(.019)
REF
6.60 ± 0.10
4.50 ± 0.10
SEE NOTE 4
2.94
(.116)
0.45 ± 0.05
1.05 ± 0.10
DETAIL B
2.94
(.116)
6.40
(.252)
BSC
0.51
(.020)
REF
DETAIL B IS THE PART OF
THE LEAD FRAME FEATURE
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8
4.30 – 4.50*
(.169 – .177)
0.25
REF
0 ° – 8 °
1.10
(.0433)
MAX
MILLIMETERS
(INCHES)
0.195 – 0.30
(.0077 – .0118)
0.09–0.20 0.50 – 0.75
(.0035 – .0079) (.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.65
(.0256) 0.05 – 0.15
BSC (.002 – .006)
FE16 (BC) TSSOP REV I 1210
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3724fd
24
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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