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| 型号： | LT3757IDD#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 26/36页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BST FLYBK INV 10DFN |
| 产品培训模块： | LT3757 and LT3758 - Boost, Flyback, SEPIC and Inverting Controllers |
| 标准包装： | 121 |
| PWM 型： | 电流模式 |
| 输出数： | 1 |
| 频率 - 最大： | 1MHz |
| 电源电压： | 2.9 V ~ 40 V |
| 降压： | 无 |
| 升压： | 是 |
| 回扫： | 是 |
| 反相： | 是 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 包装： | 管件 |
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LT3757/LT3757A
APPLICATIONS INFORMATION
Board Layout
The high speed operation of the LT3757 demands careful
attention to board layout and component placement. The
Exposed Pad of the package is the only GND terminal of
the IC, and is important for thermal management of the
IC. Therefore, it is crucial to achieve a good electrical and
thermal contact between the Exposed Pad and the ground
plane of the board. For the LT3757 to deliver its full output
power, it is imperative that a good thermal path be pro-
vided to dissipate the heat generated within the package.
It is recommended that multiple vias in the printed circuit
board be used to conduct heat away from the IC and into
a copper plane with as much area as possible.
To prevent radiation and high frequency resonance prob-
lems, proper layout of the components connected to the
IC is essential, especially the power paths with higher di/
dt. The following high di/dt loops of different topologies
C IN
should be kept as tight as possible to reduce inductive
ringing:
? In boost configuration, the high di/dt loop contains
the output capacitor, the sensing resistor, the power
MOSFET and the Schottky diode.
? In flyback configuration, the high di/dt primary loop
contains the input capacitor, the primary winding, the
power MOSFET and the sensing resistor. The high di/
dt secondary loop contains the output capacitor, the
secondary winding and the output diode.
? In SEPIC configuration, the high di/dt loop contains
the power MOSFET, sense resistor, output capacitor,
Schottky diode and the coupling capacitor.
? In inverting configuration, the high di/dt loop contains
power MOSFET, sense resistor, Schottky diode and the
coupling capacitor.
V IN
C C1
C C2
R C
R3
L1
R1
R2
1
2
LT3757
10
9
R SS
R T
3
4
8
7
C VCC
5
6
1
8
R S
2
3
M1
7
6
VIAS TO GROUND
PLANE
C OUT2
4
C OUT1
5
D1
V OUT
3757 F10
Figure 11. 8V to 16V Input, 24V/2A Output Boost Converter Suggested Layout
3757afd
26
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT3757IDD-TRPBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Boost, Flyback, SEPIC and Inverting Controller |
| LT3757IMSE | 制造商:Linear Technology 功能描述:DC DC Cntrlr Single-OUT Flyback Controller 2.9V to 40V Input 10-Pin MSOP EP 制造商:Linear Technology 功能描述:CONTROLLER |
| LT3757IMSE#PBF | 功能描述:IC REG CTRLR PWM CM 10-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:96% 电源电压:4 V ~ 36 V 降压:无 升压:是 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:24-WQFN 裸露焊盘 包装:带卷 (TR) |
| LT3757IMSE#TRPBF | 功能描述:IC REG CTRLR PWM CM 10-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:96% 电源电压:4 V ~ 36 V 降压:无 升压:是 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:24-WQFN 裸露焊盘 包装:带卷 (TR) |
| LT3757IMSEPBF | 制造商:Linear Technology 功能描述:Boost Flyback SEPIC Controller MSOP10EP |
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