参数资料
型号: LTC1735IS#PBF
厂商: Linear Technology
文件页数: 31/32页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 16-SOIC
标准包装: 50
PWM 型: 电流模式
输出数: 1
频率 - 最大: 335kHz
占空比: 99.4%
电源电压: 4 V ~ 30 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
包装: 管件
产品目录页面: 1333 (CN2011-ZH PDF)
LTC1735
PACKAGE DESCRIPTIO N
F Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1650)
6.40 – 6.60 *
4.30 – 4.50**
(.169 – .177)
0 ° – 8 °
1.10
(.0433)
MAX
(.252 – .260)
20 19 18 17 16 15 14 13 12 11
1.05 ± 0.10
0.09 – 0.20
(.0036 – .0079)
0.45 – 0.75
(.018 – .030)
0.65
(.0256)
BSC
0.195 – 0.30
0.05 – 0.15
(.002 – .006)
6.40
BSC
6.60 ± 0.10
4.50 ± 0.10
(.0077 – .0118)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
* DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
3. DRAWING NOT TO SCALE
SHALL NOT EXCEED .152mm (.006") PER SIDE
** DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
1 2 3 4 5 6 7 8 9 10
0.45 ± 0.05
F20 TSSOP 0502
0.65 TYP
RECOMMENDED SOLDER PAD LAYOUT
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.009
.015 ± .004
(0.38 ± 0.10)
× 45 °
.053 – .068
(1.351 – 1.727)
.004 – .0098
(0.102 – 0.249)
16 15 14 13 12 11 10 9
(0.229)
REF
.045 ± .005
.007 – .0098
(0.178 – 0.249)
0 ° – 8 ° TYP
.016 – .050
(0.406 – 1.270)
.008 – .012
(0.203 – 0.305)
.0250
(0.635)
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.254 MIN
.150 – .165
NOTE:
1. CONTROLLING DIMENSION: INCHES
BSC
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
INCHES
2. DIMENSIONS ARE IN
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
(MILLIMETERS) **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
GN16 (SSOP) 0502
3. DRAWING NOT TO SCALE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
1
2 3
4
5 6
7
8
.0165 ± .0015
.0250 TYP
RECOMMENDED SOLDER PAD LAYOUT
S Package
16-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.386 – .394
.050 BSC
.045 ± .005
(9.804 – 10.008)
NOTE 3
N
16
15
14
13
12
11
10
9
.245
MIN
1
2
3
.160 ± .005
N/2
.228 – .244
(5.791 – 6.197)
N
N/2
.150 – .157
(3.810 – 3.988)
NOTE 3
.030 ± .005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
3
4
5
6
7
8
.010 – .020
(0.254 – 0.508)
.008 – .010
(0.203 – 0.254)
× 45 °
0 ° – 8 ° TYP
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
.016 – .050
(0.406 – 1.270)
.014 – .019
(0.355 – 0.483)
TYP
.050
(1.270)
BSC
S16 0502
NOTE:
1. DIMENSIONS IN
INCHES
(MILLIMETERS)
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
2. DRAWING NOT TO SCALE
1735fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
31
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