参数资料
型号: LTC1909-8EG
厂商: Linear Technology
文件页数: 30/32页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 28-SSOP
标准包装: 47
PWM 型: 电流模式
输出数: 1
频率 - 最大: 200kHz
占空比: 90%
电源电压: 4 V ~ 36 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 28-SSOP(0.209",5.30mm 宽)
包装: 管件
其它名称: LTC19098EG
LTC1909-8
APPLICATIO S I FOR ATIO
PC Board Layout Checklist
When laying out a PC board follow one of the two sug-
gested approaches. The simple PC board layout requires
a dedicated ground plane layer. Also, for higher currents,
it is recommended to use a multilayer board to help with
heat sinking power components.
? The ground layer should not have any traces and it
should be as close as possible to the layer with power
MOSFETs.
? Place C IN , C OUT , MOSFETs, D1 and inductor all in one
compact area. It may help to have some components on
the bottom side of the board.
? Place LTC1909-8 chip with Pins 20 to 28 facing the
power components. Keep the components connected
to Pins 16 to 18 close to LTC1909-8 (noise sensitive
components).
? Use an immediate via to connect the components to
ground plane including SGND, GND and PGND of
LTC1909-8. Use several bigger vias for power
components.
? Use compact plane for switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
? Use planes for V IN and V OUT to maintain good voltage
filtering and to keep power losses low.
? Connect the V OSENSE , FB and GND pins of the resistor
divider directly to the output of the DC/DC converter, the
? Flood all unused areas on all layers with copper. Flood-
ing with copper will reduce the temperature rise of
power component. You can connect the copper areas to
any DC net (V IN , V OUT , GND or to any other DC rail in
your system).
When laying out a printed circuit board, without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller. These items are also illustrated in
Figure 12.
? Segregate the signal and power grounds. All small-
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to the
source of M2. Tie the GND pin directly to SGND.
? Place M2 as close to the controller as possible, keeping
the PGND, BG and SW traces short.
? Connect the input capacitor(s) C IN close to the power
MOSFETs. This capacitor carries the MOSFET AC
current.
? Keep the high dV/dT SW, BOOST and TG nodes away
from sensitive small-signal nodes.
? Connect the INTV CC decoupling capacitor C VCC closely
to the INTV CC and PGND pins.
? Connect the top driver boost capacitor C B closely to the
BOOST and SW pins.
? Connect the V IN pin decoupling capacitor C F closely to
the V IN and PGND pins.
V FB pin and the SGND pin of the controller.
19098f
30
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