参数资料
型号: LTC1955EUH
厂商: Linear Technology
文件页数: 17/22页
文件大小: 0K
描述: IC INTERFACE DL SMART CARD 32QFN
标准包装: 73
控制器类型: 智能卡接口
接口: 4 线串行
电源电压: 1.7 V ~ 5.5 V
电流 - 电源: 10µA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-WFQFN 裸露焊盘
供应商设备封装: 32-QFN 裸露焊盘(5x5)
包装: 管件
产品目录页面: 1355 (CN2011-ZH PDF)
LTC1955
4
1955fd
For more information www.linear.com/LTC1955
elecTrical characTerisTics The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VPVBATT = VSVBATT = 3.3V, DVCC = 3.3V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DOUT
Low Level Output Voltage (VOL)
Sink Current = –200A
l
0.3
V
High Level Output Voltage (VOH)
Source Current = 200A
l
DVCC – 0.3
V
UNDERV
Threshold
l
1.17
1.23
1.29
V
Leakage Current
VUNDERV = 3.3V
l
50
nA
FAULT
Low Level Output Voltage (VOL)
Sink Current = –200A
l
0.005
0.3
V
Leakage Current
VFAULT = 5.5V
l
1
A
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: This specification applies to all three smart card voltage classes:
1.8V, 3V and 5V.
Note 3: ROLCP @ (2VBATT – VCPO)/ICPO; VCPO will depend upon total load
(ICCA + ICCB) and minimum supply voltage VBATT. See Figure 5.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Serial Port Timing
tDS
DIN Valid to SCLK Setup
l
8
ns
tDH
DIN Valid to SCLK Hold
l
8
ns
tDD
DOUT Output Delay
CLOAD = 15pF
l
15
60
ns
tL
SCLK Low Time
l
50
ns
tH
SCLK High Time
l
50
ns
tCL
SCLK to LD
l
50
ns
tLC
LD to SCLK
l
0
ns
tLFC
LD Falling to SCLK
l
50
ns
Note 4: The LTC1955E is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 85°C operating
ambient temperature range are assured by design, characterization and
correlation with statistical process controls. The LTC1955I is guaranteed to
meet performance specifications over the full –40°C to 85°C temperature
range.
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LTC1955EUH#PBF 功能描述:IC INTERFACE DL SMART CARD 32QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C,串行,SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN(4x4) 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND
LTC1955EUH#TR 功能描述:IC SMART CARD INTERFC DUAL 32QFN RoHS:否 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C,串行,SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN(4x4) 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND
LTC1955EUH#TRPBF 功能描述:IC INTERFACE DL SMART CARD 32QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C,串行,SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN(4x4) 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND
LTC1955IUH#PBF 功能描述:IC SMART CARD INTERFACE DL 32QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C,串行,SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN(4x4) 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND
LTC1955IUH#TRPBF 功能描述:IC SMART CARD INTERFACE DL 32QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C,串行,SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN(4x4) 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND