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参数资料
| 型号： | LTC3125EDCB#PBF |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 稳压器 |
| 英文描述： | SWITCHING REGULATOR, 1900 kHz SWITCHING FREQ-MAX, PDSO8 |
| 封装： | 2 X 2 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, DFN-8 |
| 文件页数： | 12/18页 |
| 文件大小： | 303K |
| 代理商： | LTC3125EDCB#PBF |
LTC3125
3
3125fa
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3125 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3125E (E Grade) is guaranteed to meet specications
from 0°C to 85°C junction temperature. Specications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
junction temperature (TJ) is calculated from the ambient temperature
(TA) and power dissipation (PD) according to the formula: TJ = TA + (PD)
(
θJA °C/W), where θJA is the package thermal impedance. The maximum
ambient temperature consistent with these specications is determined by
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
PROG Current Gain
(Note 3)
22.1
kΩ-A/A
Maximum Duty Cycle
VFB = 1.15V
l
85
92
%
Minimum Duty Cycle
VFB = 1.3V
l
0%
Frequency
l
1.3
1.6
1.9
MHz
SHDN Input High
1V
SHDN Input Low
0.35
V
SHDN Input Current
VSHDN = 1.2V
0.3
1
μA
ELECTRICAL CHARACTERISTICS The l denotes the specications which apply over the full operating
junction temperature range, otherwise specications are at TA = 25°C. VIN = 3.3V, VOUT = 4.5V unless otherwise noted (Note 2).
specic operating conditions in conjunction with board layout, the rated
package thermal resistance and other environmental factors.
Note 3: Specication is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specied maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much higher than
60°C/W.
TYPICAL PERFORMANCE CHARACTERISTICS
Efciency vs Load Current,
VOUT = 2.5V
Efciency vs Load Current,
VOUT = 3.3V
(TA = 25°C unless otherwise noted)
LOAD CURRENT (A)
0.001
40
EFFICIENCY
(%)
POWER
LOSS
(W)
50
60
70
80
0.01
0.1
1
3125 G01
30
20
10
0
90
100
0.1
0.01
0.0001
0.001
1
VIN = 2.1V
VIN = 1.8V
LOAD CURRENT (A)
0.001
40
EFFICIENCY
(%)
POWER
LOSS
(W)
50
60
70
80
0.01
0.1
1
3125 G02
30
20
10
0
90
100
0.1
0.01
0.001
1
VIN = 2.8V
VIN = 2.4V
VIN = 2V
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