参数资料
型号: LTC3407EDD#TRPBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 1A DL 10DFN
标准包装: 2,500
类型: 降压(降压)
输出类型: 可调式
输出数: 2
输出电压: 0.6 V ~ 5 V
输入电压: 2.5 V ~ 5.5 V
PWM 型: 电流模式,混合
频率 - 开关: 1.5MHz
电流 - 输出: 1A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 10-DFN(3x3)
LTC3407
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
0.70 ± 0.05
R = 0.125
TYP
6
10
0.40 ± 0.10
3.55 ± 0.05
1.65 ± 0.05
3.00 ± 0.10
1.65 ± 0.10
2.15 ± 0.05 (2 SIDES)
PACKAGE
PIN 1
TOP MARK
(4 SIDES)
(2 SIDES)
OUTLINE
(SEE NOTE 6)
5
1
(DD) DFN REV B 0309
0.25 ± 0.05
0.50
0.200 REF
0.75 ± 0.05
0.25 ± 0.05
0.50 BSC
BSC
2.38 ± 0.10
2.38 ± 0.05
(2 SIDES)
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.06 ± 0.102
1 (.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
5.23
(.206)
MIN
2.083 ± 0.102
(.082 ± .004)
3.20 – 3.45
(.126 – .136)
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
0.305 ± 0.038
0.50
0.53 ± 0.152
(.021 ± .006)
1 2 3 4 5
10
DETAIL “B”
(.0120 ± .0015) (.0197)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
0.18
DETAIL “A”
1.10
(.043)
0.86
(.034)
0.29
REF
(.007)
MAX
REF
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
0.1016 ± 0.0508
(.004 ± .002)
0.05 REF
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MSOP (MSE) 0908 REV C
3407fa
15
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