参数资料
型号: LTC3522EUD#TRPBF
厂商: Linear Technology
文件页数: 16/20页
文件大小: 0K
描述: IC REG BUCK BOOST SYNC ADJ 16QFN
标准包装: 2,500
类型: 降压(降压),升压(升压)
输出类型: 可调式
输出数: 2
输出电压: 0.6 V ~ 5.5 V
输入电压: 2.4 V ~ 5.5 V
PWM 型: 电流模式,混合
频率 - 开关: 1.07MHz
电流 - 输出: 200mA,400mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 16-QFN-EP(3x3)
LTC3522
APPLICATIONS INFORMATION
of inductors that are well suited to many LTC3522 buck
converter applications.
Table 4. Representative Surface Mount Inductors
MAX
PCB Layout Considerations
The LTC3522 switches large currents at high frequencies.
Special care should be given to the PCB layout to ensure
stable, noise-free operation. Figure 5 depicts the recom-
MANUFACTURER PART NUMBER VALUE CURRENT
Taiyo Yuden NP035B-4R7M 4.7μH 1.2A
DCR HEIGHT
0.047 Ω 1.8mm
mended PCB layout to be utilized for the LTC3522. A few
key guidelines follow:
Coilcraft
Sumida
NP035B-6R8M 6.8μH
MSS6132-472ML 4.7μH
MSS6132-822ML 8.2μH
CDRH2D14NP- 4.7μH
4R7N
1.0A
1.8A
1.35A
1.0A
0.084 Ω 1.8mm
0.056 Ω 3.2mm
0.070 Ω 3.2mm
0.135 Ω 1.55mm
1. All circulating high current paths should be kept as short
as possible. This can be accomplished by keeping the
routes to all bold components in Figure 5 as short and
as wide as possible. Capacitor ground connections
CDRH2D18/
HPNP-4R7N
4.7μH
1.2A
0.110 Ω 2.0mm
should via down to the ground plane in the shortest
route possible. The bypass capacitors on PV IN1 and
Cooper-
Bussmann
CDRH3D16NP-
4R7N
SD18-4R7
SD10-4R7
4.7μH
4.7μH
4.7μH
0.9A
1.54A
1.08A
0.08 Ω 1.8mm
0.082 Ω 1.8mm
0.153 Ω 1.0mm
PV IN2 should be placed as close to the IC as possible and
should have the shortest possible paths to ground.
2. The small-signal ground pad (GND) should have a single
point connection to the power ground. A convenient
Capacitor Vendor Information
Both the input and output capacitors used with the LTC3522
must be low ESR and designed to handle the large AC cur-
rents generated by switching converters. The vendors in
Table 5 provide capacitors that are well suited to LTC3522
application circuits.
Table 5. Capacitor Vendor Information
REPRESENTATIVE PART
way to achieve this is to short the pin directly to the
Exposed Pad as shown in Figure 5.
3. The components shown in bold and their connections
should all be placed over a complete ground plane.
4. To prevent large circulating currents from disrupting
the output voltage sensing, the ground for each resistor
divider should be returned directly to the small signal
ground pin (GND).
MANUFACTURER
Taiyo Yuden
TDK
Murata
AVX
WEB SITE
www.t-yuden.com
www.component.
tdk.com
www.murata.com
www.avxcorp.com
NUMBERS
JMK107BJ105MA 4.7μF, 6.3V
C2012X5R0J475K 4.7μF, 6.3V
GRM219R61A475K 4.7μF
SM055C475KHN480 4.7μF
5. Use of vias in the die attach pad will enhance the ther-
mal environment of the converter especially if the vias
extend to a ground plane region on the exposed bottom
surface of the PCB.
6. Keep the connection from the resistor dividers to the
feedback pins FB1 and FB2 as short as possible and
away from the switch pin connections.
3522fa
16
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