参数资料
型号: LTC3867EUF#PBF
厂商: Linear Technology
文件页数: 9/36页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 24-QFN
产品培训模块: LTC3867 Synchronous Step-Down DC/DC Controller
标准包装: 91
PWM 型: 电流模式
输出数: 1
频率 - 最大: 1.2MHz
占空比: 98%
电源电压: 4 V ~ 38 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 24-WFQFN 裸露焊盘
包装: 管件
LTC3867
PIN FUNCTIONS
INTV CC (Pin 16): Internal 5.3V Regulator Output and
Bottom MOSFET Driver Supply. The control circuits are
powered from this voltage. Decouple this pin to PGND
with a minimum of 4.7μF low ESR tantalum or ceramic
capacitor.
BG (Pin 17): Bottom Gate Driver Output. This pin drives
the gate(s) of the bottom N-channel MOSFET(s) between
PGND and INTV CC .
PGND (Pin 18): Power Ground Pin. Connect this pin closely
to the source(s) of the bottom N-channel MOSFET(s), the
(–) terminal of C VCC and (–) terminal of C IN .
SW (Pin 19): Switch Node Connection to the Inductor.
Voltage swing at this pin is from a Schottky diode (external)
voltage drop below ground to V IN .
TG (Pin 20): Top Gate Driver Output. This is the output of
the floating driver with a voltage swing equal to INTV CC
superimposed on the SW voltage.
BOOST (Pin 21): Boosted Floating Driver Supply. The (+)
terminal of the bootstrap capacitor connects to this pin.
This pin swings from a diode drop below INTV CC up to
V IN + INTV CC .
PGOOD (Pin 22): Power Good Indicator Output. Open-
drain output that pulls to ground when output voltage is
not in regulation.
MODE/PLLIN (Pin 23): This is a dual function pin. Tying
this pin to SGND, INTV CC or floating it enables forced
continuous mode, pulse-skipping mode or Burst Mode
operation respectively. Applying a clock signal to this pin
causes the internal PLL to synchronize the internal oscilla-
tor to the clock signal and forces forced continuous mode.
The PLL compensation network is integrated on to the IC.
FREQ (Pin 24): Frequency Set/Select Pin. A resistor be-
tween this pin and SGND sets the switching frequency.
This pin sources 20μA.
SGND (Exposed Pad Pin 25): Signal Ground. The exposed
pad must be soldered to the PCB ground for electrical con-
nection and rated thermal performance. All small-signal
components and compensation components should be
connected here. Connect to PGND at one point, close to
the IC.
3867f
9
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