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参数资料
| 型号： | LX1675ILQ-TR |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 稳压器 |
| 英文描述： | 1.5 A SWITCHING CONTROLLER, 690 kHz SWITCHING FREQ-MAX, PQCC38 |
| 封装： | 5 X 7 MM, ROHS COMPLIANT, PLASTIC, MLPQ-38 |
| 文件页数： | 12/19页 |
| 文件大小： | 324K |
| 代理商： | LX1675ILQ-TR |
LX1675
PRODUCTION DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2004
Rev. 1.2a, 2006-02-16
WWW
.Microse
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i
.CO
M
Multiple Output LoadSHARE PWM
TM
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VIN, VSLR, HRX) ............................................................... -0.3V to 24V
Supply Voltage (VCCL) ................................................................................ -0.3V to 6.0V
Driver Supply Voltage (VCX) ........................................................................ -0.3V to 30V
Current Sense Inputs (CSX)............................................................................ -0.3V to 30V
Error Amplifier Inputs (FBX, RF2, LDFB) .................................................... -0.3V to 5.5V
Internal regulator Current (IVCCL)............................................................................... 50mA
Output Drive Peak Current Source (HOX, LOX) ................................................ 1A (200ns)
Output Drive Peak Current Sink (HOX, LOX) ................................................. 1.5A (200ns)
Differential Voltage: VHOX – VHRX (High Side Return) .................................... -0.3V to 6V
Soft Start Input (SSX, SSL) ............................................................................-0.3V to VREF
Logic Inputs (SF, FS)..........................................................................-0.3V to VCCL + 0.5V
LDO Gate Drive (LDGD) Output Drive can source .................................................. 10mA
LDO Feedback (LDFB) Input.......................................................................................6.0V
Operating Junction Temperature................................................................................ 150°C
Operating Temperature Range .......................................................................-40°C to 85°C
Storage Temperature Range.........................................................................-65
°C to 150°C
Peak Package Solder Reflow Temp. (40 seconds maximum exposure) ......... 260°C (+0 -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
Limitations affecting transient pulse duration is thermally related to the clamping zener
diodes connected to the supply pins, application of maximum voltage will increase current
into that pin and increase power dissipation.
x denotes respective pin designator 1, 2, or 3.
TH ERMAL DATA
LQ Plastic MLPQ 38-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
30 to 55
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA numbers are dependent on heat spreading and layout considerations for the thermal
performance of the device/pc-board system. All of the above assume no ambient airflow.
PACKAGE PIN OUT
LO2
HR2
HO2
VC2
CS2
SF
EO2
SS2
RF2
EO1
FB1
SS3
FB3
EO3
FS
CS3
DGND
CS1
VIN
VCCL
PG3
LO3
HO
3
VC3
VC1
HO
1
HR
1
LO1
PG1
LDG
D
VS
L
R
SS
L
LD
FB
SS
1
AGND
VR
E
F
FB2
HR3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
Connect Bottom to
Power GND
LQ PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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