参数资料
型号: M5LV-128/74-15VI
厂商: Lattice Semiconductor Corporation
文件页数: 23/42页
文件大小: 0K
描述: IC CPLD 128MC 74I/O 100TQFP
标准包装: 90
系列: MACH® 5
可编程类型: 系统内可编程
最大延迟时间 tpd(1): 15.0ns
电压电源 - 内部: 3 V ~ 3.6 V
宏单元数: 128
输入/输出数: 74
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 托盘
MACH 5 Family
3
Note:
1.
C = Commercial grade, I = Industrial grade
2.
/1 version recommended for new designs
With Lattice’s unique hierarchical architecture, the MACH 5 family provides densities up to 512 macrocells to
support full system logic integration. Extensive routing resources ensure pinout retention as well as high
utilization. It is ideal for PAL block device integration and a wide range of other applications including high-
speed computing, low-power applications, communications, and embedded control. At each macrocell density
point, Lattice offers several I/O and package options to meet a wide range of design needs (Table 3).
Note:
1.
The I/O options indicated with a “*” are obsolete, please contact factory for more information.
Advanced power management options allow designers to incrementally reduce power while maintaining the
level of performance needed for today’s complex designs. I/O safety features allow for mixed-voltage design,
Table 2. MACH 5 Speed Grades
Device
Speed Grade1
-5
-6
-7
-10
-12
-15
-20
M5-1282
C
C, I
I
M5-128/1
C
C, I
I
M5LV-128
C
C,I
C, I
I
M5-192/1
C
C, I
I
M5-2562
C
C, I
I
M5-256/1
C
C, I
I
M5LV-256
C
C, I
I
M5-320
C
C, I
I
M5LV-320
C
C, I
I
M5-384
C
C, I
I
M5LV-384
C
C, I
I
M5-512
C
C, I
I
M5LV-512
C
C, I
I
Table 3. MACH 5 Package and I/O Options 1
M5-128/1
M5LV-128
M5-192/1
M5-256/1
M5LV-256
M5-320
M5LV-320
M5-384
M5LV-384
M5-512
M5LV-512
Supply Voltage
5
3.3
5
3.3
5
3.3
5
3.3
5
3.3
100-pin TQFP
68
68, 74
68
68*, 74
100-pin PQFP
68
68*
68
144-pin TQFP
104
144-pin PQFP
104
104*
160-pin PQFP
120
120*
120
120*
120
120*
120
208-pin PQFP
160
240-pin PQFP
184*
256-ball BGA
192
192*
352-ball BGA
256
Select
devices
have
been
discontinued.
See
Ordering
Information
section
for
product
status.
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