参数资料
型号: MAX1401EAI+T
厂商: Maxim Integrated Products
文件页数: 29/36页
文件大小: 0K
描述: IC ADC 18BIT LP 28-SSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,000
位数: 18
采样率(每秒): 480
数据接口: QSPI?,串行,SPI?
转换器数目: 1
功率耗散(最大): 750µW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-SSOP(0.209",5.30mm 宽)
供应商设备封装: 28-SSOP
包装: 带卷 (TR)
输入数目和类型: 3 个差分,单极;3 个差分,双极;5 个伪差分,单极;5 个伪差分,双极
Grounding and Layout
For best performance, use printed circuit boards with
separate analog and digital ground planes. Wire-wrap
boards are not recommended.
Design the printed circuit board so the analog and digi-
tal sections are separated and confined to different
areas of the board. Join the digital and analog ground
planes at only one point. If the MAX1401 is the only
device requiring an AGND to DGND connection, then
the ground planes should be connected at the AGND
and DGND pins of the MAX1401. In systems where
multiple devices require AGND to DGND connections,
the connection should still be made at only one point.
Make the star ground as close to the MAX1401 as pos-
sible.
Avoid running digital lines under the device, because
these may couple noise onto the die. Run the analog
ground plane under the MAX1401 to minimize coupling
of digital noise. Make the power-supply lines to the
MAX1401 as wide as possible to provide low-imped-
ance paths and reduce the effects of glitches on the
power-supply line.
Shield fast switching signals, such as clocks, with digi-
tal ground to avoid radiating noise to other sections of
the board. Avoid running clock signals near the analog
inputs. Avoid crossover of digital and analog signals.
Traces on opposite sides of the board should run at
right angles to each other. This will reduce the effects
of feedthrough on the board. A microstrip technique is
best, but is not always possible with double-sided
boards. In this technique, the component side of the
board is dedicated to ground planes while signals are
placed on the solder side.
Good decoupling is important when using high-resolu-
tion ADCs. Decouple all analog supplies with 10F tan-
talum capacitors in parallel with 0.1F HF ceramic
capacitors to AGND. Place these components as close
to the device as possible to achieve the best decou-
pling.
See the MAX1403 evaluation kit manual for recom-
mended layout. The evaluation board package
includes a fully assembled and tested evaluation
board.
MAX1401
+3V, 18-Bit, Low-Power, Multichannel,
Oversampling (Sigma-Delta) ADC
______________________________________________________________________________________
35
Chip Information
TRANSISTOR COUNT: 34,648
SUBSTRATE CONNECTED TO AGND
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MAX1402CAI 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40
MAX1402CAI+ 功能描述:模数转换器 - ADC 18-Bit 5Ch 4.8ksps 2.5V Precision ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
MAX1402CAI+T 功能描述:模数转换器 - ADC 18-Bit 5Ch 4.8ksps 2.5V Precision ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
MAX1402CAI-T 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40
MAX1402EAI 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40