参数资料
型号: MAX1421CCM+D
厂商: Maxim Integrated Products
文件页数: 10/17页
文件大小: 0K
描述: IC ADC 12BIT 40MSPS 48LQFP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 250
位数: 12
采样率(每秒): 40M
数据接口: 并联
转换器数目: 1
功率耗散(最大): 214mW
电压电源: 模拟和数字
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 48-LQFP
供应商设备封装: 48-LQFP(7x7)
包装: 托盘
输入数目和类型: 1 个差分,双极
MAX1421
12-Bit, 40Msps, 3.3V, Low-Power ADC
with Internal Reference
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = VDVDD = 3.3V, AGND = DGND = 0, VIN = ±1.024V, differential input voltage at -0.5dB FS, internal reference,
fCLK = 40MHz (50% duty cycle), digital output load CL
≈ 10pF, TA ≥ +25°C guaranteed by production test, TA < +25°C guarnateed
by design and characterization. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD, DVDD to AGND..............................................-0.3V to +4V
DVDD, AVDD to DGND..............................................-0.3V to +4V
DGND to AGND.....................................................-0.3V to +0.3V
INP, INN, REFP, REFN, REFIN,
CML, CLK, CLK,....................(AGND - 0.3V) to (AVDD + 0.3V)
D0–D11, OE, PD .......................(DGND - 0.3V) to (DVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
48-Pin TQFP (derate 12.5mW/°C above +70°C)........1000mW
Maximum Junction Temperature .....................................+150°C
Operating Temperature Ranges
MAX1421CCM ...................................................0°C to +70°C
MAX1421ECM ................................................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
RES
12
Bits
TA = +25
°C, no missing codes
-1
+1
Differential Nonlinearity
DNL
TA = TMIN to TMAX
±0.5
LSB
Integral Nonlinearity
INL
TA = TMIN to TMAX
±2
LSB
Midscale Offset
MSO
-3
±.75
+3
%FSR
Midscale Offset Temperature
Coefficient
MSOTC
3 10-4
%/
°C
Internal reference (Note 1)
-5
+0.1
+5
External reference applied to REFIN (Note 2)
-5
±3
+5
Gain Error
GE
External reference applied to REFP, CML,
and REFN (Note 3)
-1.5
±0.5
+1.5
%FSR
Gain-Error Temperature
Coefficient
GETC
External reference applied to REFP, CML,
and REFN (Note 3)
15 10-6
%/
°C
DYNAMIC PERFORMANCE (fCLK = 40MHz, 4096-point FFT)
fIN = 5MHz
67
Signal-to-Noise Ratio
SNR
fIN = 15MHz, TA = +25
°C62
66
dB
fIN = 5MHz
73
Spurious-Free Dynamic Range
SFDR
fIN = 15MHz, TA = +25
°C64
70
dBc
fIN = 5MHz
-74
Total Harmonic Distortion
THD
fIN = 15MHz, TA = +25
°C
-69
-62
dBc
fIN = 5MHz
66
Signal-To-Noise Plus Distortion
SINAD
fIN = 15MHz, TA = +25
°C60
63.5
dB
fIN = 5MHz
10.7
Effective Number of Bits
ENOB
fIN = 15MHz, TA = +25
°C60
10.3
Bits
Two-Tone Intermodulation
Distortion
IMDTT
fIN1 = 11.569MHz, fIN2 = 13.445MHz
(Note 4)
-80
dBc
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