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| 型号： | MAX15046BAEE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/24页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 16-QSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| PWM 型： | 电压模式 |
| 输出数： | 1 |
| 频率 - 最大： | 1.1MHz |
| 占空比： | 87.5% |
| 电源电压： | 4.5 V ~ 40 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 16-LSSOP（0.154"，3.90mm 宽）裸露焊盘 |
| 包装： | 带卷 (TR) |
MAX15046
40V, High-Performance, Synchronous
Buck Controller
ABSOLUTE MAXIMUM RATINGS
IN to GND ..............................................................-0.3V to +45V
V CC to GND..................... -0.3V to lower of (V IN + 0.6V) and 6V
EN, DRV to GND .....................................................-0.3V to +6V
PGOOD to GND ....................................................-0.3V to +45V
PGND to GND ......................................................-0.3V to +0.3V
DL to PGND.............................................-0.3V to (V DRV + 0.3V)
BST to PGND .......................................................-0.3V to +50V
LX and CSP to PGND...............................................-1V to +45V
LX and CSP to PGND............................-2V (50ns max) to +45V
BST to LX.................................................................-0.3V to +6V
CSP to LX .............................................................-0.3V to +0.3V
All Other Pins to GND .............................. -0.3V to (V CC + 0.3V)
V CC Short Circuit to GND..........................................Continuous
PGOOD Maximum Sink Current .........................................20mA
Continuous Power Dissipation (T A = +70 N C):
16-Pin QSOP (derate 9.6mW/ N C above +70 N C) .......771.5mW
16-Pin QSOP-EP (derate 22.7mW/ N C above +70 N C) 1818.2mW
Operating Temperature Range ........................ -40 N C to +125 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
DH to LX .................................................. -0.3V to (V BST + 0.3V)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
QSOP
Junction-to-Ambient Thermal Resistance ( q JA ) .... +103.7°C/W
Junction-to-Case Thermal Resistance ( q JC ) .............. +37°C/W
QSOP-EP
Junction-to-Ambient Thermal Resistance ( q JA ) ......... +44°C/W
Junction-to-Case Thermal Resistance ( q JC ) ................ +6°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 24V, V EN = 5V, V GND = V PGND = 0V, C IN = 1 F F, C VCC = 4.7 F F, R RT = 49.9k I , T A = T J = -40 N C to +125 N C, unless otherwise
noted. Typical values are at T A = +25 N C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SYSTEM SPECIFICATIONS
Input-Voltage Range
Quiescent Supply Current
Shutdown Supply Current
V IN
I IN_Q
I IN_SBY
V IN = V CC = V DRV
V IN = 24V, V FB = 0.9V, no switching
V IN = 24V, V EN = 0V, I VCC = 0,
PGOOD = unconnected
4.5
4.5
2
0.35
40
5.5
3
0.55
V
mA
mA
V CC REGULATOR
Output Voltage
V CC Regulator Dropout
V CC Short-Circuit Output Current
V CC Undervoltage Lockout
V CC
V CCUVLO
6V ≤ V IN ≤ 40V, I LOAD = 6mA
V IN = 4.5V, I LOAD = 25mA
V IN = 5V
V CC rising
5
30
3.8
5.25
0.18
55
4
5.5
0.45
90
4.2
V
V
mA
V
V CC Undervoltage Lockout
Hysteresis
ERROR AMPLIFIER (FB, COMP)
400
mV
FB Input-Voltage Set Point
V FB
584
590
596
mV
FB Input Bias Current
I FB
V FB = 0.6V
-250
+250
nA
FB to COMP Transconductance
g M
I COMP = Q 20 F A
600
1200
1800
F S
Open-Loop Gain
80
dB
Unity-Gain Bandwidth
2
Capacitor from COMP to GND =
47pF
5
MHz
Maxim Integrated
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX15046BEEE+ | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
| MAX15046BEVKIT+ | 功能描述:电源管理IC开发工具 MAX15046B Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX15046CAEE+ | 功能描述:DC/DC 开关控制器 40V Synch Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX15046CAEE+T | 功能描述:DC/DC 开关控制器 40V Synch Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX15046EEE+ | 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
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