参数资料
型号: MAX16031ETM+T
厂商: Maxim Integrated Products
文件页数: 36/41页
文件大小: 0K
描述: IC SYSTEM MON EEPROM 48-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 多压监控器
监视电压数目: 8
输出: 开路漏极或开路集电极
复位: 低有效
复位超时: 可调节/可选择
电压 - 阀值: 8 种可选阀值组合
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-WFQFN 裸露焊盘
供应商设备封装: 48-TQFN-EP(7x7)
包装: 带卷 (TR)
EEPROM-Based System Monitors
with Nonvolatile Fault Memory
REGISTERS
AND EEPROM
01101
01100
MEMORY WRITE REGISTER
[LENGTH = 8 BITS]
MEMORY READ REGISTER
[LENGTH = 8 BITS]
MEMORY ADDRESS REGISTER
[LENGTH = 8 BITS]
BOUNDARY SCAN REGISTER
[LENGTH = 198 BITS]
01010
01001
01000
MUX 1
00001
00010
USER CODE REGISTER
[LENGTH = 32 BITS]
00100
COMMAND
DECODER
IDENTIFICATION REGISTER
[LENGTH = 32 BITS]
BYPASS REGISTER
[LENGTH = 1 BIT]
00000
11111
01101
01100
SAVE
REBOOT
V DBP
INSTRUCTION REGISTER
[LENGTH = 5 BITS]
R PU
TDI
TMS
TCK
Figure 6. JTAG Block Diagram
TEST ACCESS PORT
(TAP) CONTROLLER
MUX 2
TDO
Run-Test/Idle: The run-test/idle state is used between
scan operations or during specific tests. The instruction
register and test data registers remain idle.
Select-DR-Scan: All test data registers retain their pre-
vious state. With TMS low, a rising edge of TCK moves
the controller into the capture-DR state and initiates a
scan sequence. TMS high during a rising edge on TCK
moves the controller to the select-IR-scan state.
Capture-DR: Data are parallel-loaded into the test data
registers selected by the current instruction. If the instruc-
tion does not call for a parallel load or the selected test
data register does not allow parallel loads, the test data
register remains at its current value. On the rising edge of
TCK, the controller goes to the shift-DR state if TMS is low
or it goes to the exit1-DR state if TMS is high.
Shift-DR: The test data register selected by the current
instruction is connected between TDI and TDO and
shifts data one stage toward its serial output on each
rising edge of TCK while TMS is low. On the rising edge
of TCK, the controller goes to the exit1-DR state if TMS
is high.
Exit1-DR: While in this state, a rising edge on TCK puts
the controller in the update-DR state. A rising edge on
TCK with TMS low puts the controller in the pause-DR
state.
Pause-DR: Shifting of the test data registers is halted
while in this state. All test data registers retain their pre-
vious state. The controller remains in this state while
TMS is low. A rising edge on TCK with TMS high puts
the controller in the exit2-DR state.
36
______________________________________________________________________________________
相关PDF资料
PDF描述
MAX16040PLA31+T IC BATTERY BACKUP 3.08V 8-UDFN
MAX16043TG+T IC SUPERVISOR CIRC QUAD 24TQFN
MAX16046ATN+ IC EE-PROG SYS MGR 12CH 56-TQFN
MAX16047ETN+ IC EE-PROG SYS MGR 12CH 56-TQFN
MAX16051ETI+T IC POWER MONITR/SEQUENCER 28TQFN
相关代理商/技术参数
参数描述
MAX16031EVKIT+ 功能描述:电源管理IC开发工具 MAX16031 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V
MAX16032ETM+ 功能描述:监控电路 EEPROM-Based w/NV Fault Memory RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16032ETM+T 功能描述:监控电路 EEPROM-Based w/NV Fault Memory RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16033LLB23+ 制造商:Maxim Integrated Products 功能描述:VOLT SUPERVISOR MONITOR 2.32V 10PIN UDFN - Rail/Tube
MAX16033LLB23+T 功能描述:监控电路 Battery Backup 2.5V-Ep RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel