参数资料
型号: MAX16046ATN+
厂商: Maxim Integrated Products
文件页数: 57/70页
文件大小: 0K
描述: IC EE-PROG SYS MGR 12CH 56-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 37
类型: 系统管理器
监视电压数目: 12
输出: 开路漏极,推挽式
复位: 低有效
复位超时: 可调节/可选择
电压 - 阀值: 可调节/可选择
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 56-WFQFN 裸露焊盘
供应商设备封装: 56-TQFN-EP(8x8)
包装: 托盘
MAX16046/MAX16048
12-Channel/8-Channel EEPROM-Programmable
System Managers with Nonvolatile Fault Registers
Table 33. JTAG Instruction Set
INSTRUCTION
BYPASS
IDCODE
USERCODE
LOAD ADDRESS
READ DATA
WRITE DATA
REBOOT
SAVE
SETEXTRAM
RSTEXTRAM
SETEEPADD
RSTEEPADD
HEX CODE
1Fh
00h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
SELECTED REGISTER/ACTION
Bypass. Mandatory instruction code.
Manufacturer ID code and part number
User code (user-defined ID)
Load address register content
Memory read
Memory write
Resets the device
Stores current fault information in EEPROM
Extended page access on
Extended page access off
EEPROM page access on
EEPROM page access off
BYPASS: When the BYPASS instruction is latched into
the instruction register, TDI connects to TDO through
the 1-bit bypass test data register. This allows data to
pass from TDI to TDO without affecting the device’s
normal operation.
IDCODE: When the IDCODE instruction is latched into
the parallel instruction register, the identification data
register is selected. The device identification code is
loaded into the identification data register on the rising
Table 34. 32-Bit Identification Code
MSB
edge of TCK following entry into the capture-DR state.
Shift-DR can be used to shift the identification code out
serially through TDO. During test-logic-reset, the
IDCODE instruction is forced into the instruction regis-
ter. The identification code always has a ‘1’ in the LSB
position. The next 11 bits identify the manufacturer’s
JEDEC number and number of continuation bytes fol-
lowed by 16 bits for the device and 4 bits for the ver-
sion. See Table 34.
LSB
Version (4 bits)
0000
Device ID (16 bits)
0000000000000001
Manufacturer ID (11 bits)
00011001011
Fixed value (1 bit)
1
USERCODE: When the USERCODE instruction latches
into the parallel instruction register, the user-code data
register is selected. The device user-code loads into
the user-code data register on the rising edge of TCK
following entry into the capture-DR state. Shift-DR can
Table 35. 32-Bit User-Code Data
MSB
be used to shift the user-code out serially through TDO.
See Table 35. This instruction may be used to help
identify multiple MAX16046/MAX16048 devices con-
nected in a JTAG chain.
LSB
D.C. (don’t cares)
00000000000000000
Maxim Integrated
I 2 C/SMBus
slave address
See Table 31
User identification (firmware version)
r5Ch[7:0] contents
57
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MAX16046ATN+ 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16046ATN+T 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16046ECB+ 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16046ECB+T 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16046ETN+ 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel