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参数资料
| 型号： | MAX5863ETM+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 16/26页 |
| 文件大小： | 0K |
| 描述： | IC AFE 8/10BIT 7.5MSPS 48-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 43 |
| 位数： | 8，10 |
| 通道数： | 8 |
| 功率（瓦特）： | 22.8mW |
| 电压 - 电源，模拟： | 2.7 V ~ 3.3 V |
| 电压 - 电源，数字： | 1.8 V ~ 3.3 V |
| 封装/外壳： | 48-WFQFN 裸露焊盘 |
| 供应商设备封装： | 48-TQFN-EP（7x7） |
| 包装： | 管件 |
MAX5863
Ultra-Low-Power, High-Dynamic
Performance, 7.5Msps Analog Front End
ADC Offset Error
Ideally, the midscale transition occurs at 0.5 LSB above
midscale. The offset error is the amount of deviation
between the measured transition point and the ideal
transition point.
DAC Offset Error
Offset error is the difference between the ideal and
actual offset point. The offset point is the output value
when the digital input is midscale. This error affects all
codes by the same amount and usually can be com-
pensated by trimming.
ADC Gain Error
Ideally, the ADC full-scale transition occurs at 1.5 LSB
below full scale. The gain error is the amount of devia-
tion between the measured transition point and the
ideal transition point with the offset error removed.
ADC Dynamic Parameter Definitions
Aperture Jitter
Figure 13 depicts the aperture jitter (tAJ), which is the
sample-to-sample variation in the aperture delay.
Aperture Delay
Aperture delay (tAD) is the time defined between the
rising edge of the sampling clock and the instant when
an actual sample is taken (Figure 13).
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of
the full-scale analog input (RMS value) to the RMS
quantization error (residual error) and results directly
from the ADC’s resolution (N bits):
SNR(max) = 6.02dB x N + 1.76dB (in dB)
In reality, there are other noise sources besides quanti-
zation noise: thermal noise, reference noise, clock jitter,
etc. SNR is computed by taking the ratio of the RMS
signal to the RMS noise. RMS noise includes all spec-
tral components to the Nyquist frequency excluding the
fundamental, the first five harmonics, and the DC offset.
Signal-to-Noise Plus Distortion (SINAD)
SINAD is computed by taking the ratio of the RMS sig-
nal to the RMS noise. RMS noise includes all spectral
components to the Nyquist frequency excluding the
fundamental and the DC offset.
Effective Number of Bits (ENOB)
ENOB specifies the dynamic performance of an ADC at a
specific input frequency and sampling rate. An ideal
ADC’s error consists of quantization noise only. ENOB for
a full-scale sinusoidal input waveform is computed from:
ENOB = (SINAD - 1. 76) / 6.02
Total Harmonic Distortion (THD)
THD is typically the ratio of the RMS sum of the first five
harmonics of the input signal to the fundamental itself.
This is expressed as:
where V1 is the fundamental amplitude and V2–V6 are
the amplitudes of the 2nd- through 6th-order harmon-
ics.
Third Harmonic Distortion (HD3)
HD3 is defined as the ratio of the RMS value of the third
harmonic component to the fundamental input signal.
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio expressed in decibels of the RMS
amplitude of the fundamental (maximum signal compo-
nent) to the RMS value of the next-largest spurious
component, excluding DC offset.
Intermodulation Distortion (IMD)
IMD is the total power of the intermodulation products
relative to the total input power when two tones, f1 and
f2, are present at the inputs. The intermodulation prod-
ucts are (f1 ±f2), (2 f1), (2 f2), (2 f1 ±f2), (2 f2
±f1). The individual input tone levels are at -7dBFS.
3rd-Order Intermodulation (IM3)
IM3 is the power of the worst third-order intermodula-
tion product relative to the input power of either input
tone when two tones, f1 and f2, are present at the
inputs. The 3rd-order intermodulation products are (2 x
f1 ±f2), (2 f2 ±f1). The individual input tone levels are
at -7dBFS.
THD
(V +V +V +V +V )
V
2
3
2
4
2
5
2
6
2
1
=
20log
HOLD
ANALOG
INPUT
SAMPLED
DATA (T/H)
T/H
tAD
tAJ
TRACK
CLK
Figure 13. T/H Aperture Timing
______________________________________________________________________________________________________
23
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5863ETM+ | 功能描述:ADC / DAC多通道 10-Bit 2Ch 7.5Msps CODEC/AFE RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5863ETM+T | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5863ETM-T | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5864ETM | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5864ETM+ | 功能描述:ADC / DAC多通道 10-Bit 2Ch 22Msps CODEC/AFE RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
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