参数资料
型号: MAX8620YETD+T
厂商: Maxim Integrated Products
文件页数: 18/18页
文件大小: 0K
描述: IC UPMIC FOR MPU 14-TDFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
应用: 微型电源管理集成电路(UPMIC),DSP
输入电压: 2.7 V ~ 5.5 V
输出数: 3
输出电压: 0.6 V ~ 3.3 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 14-WFDFN 裸露焊盘
供应商设备封装: 14-TDFN-EP(3x3)
包装: 带卷 (TR)
μPMIC for Microprocessors or DSPs
in Portable Equipment
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages .)
COMMON DIMENSIONS
SYMBOL
A
D
E
A1
MIN.
0.70
2.90
2.90
0.00
MAX.
0.80
3.10
3.10
0.05
L
k
A2
0.20 0.40
0.25 MIN.
0.20 REF.
PACKAGE VARIATIONS
PKG. CODE
T633-1
T633-2
T833-1
T833-2
T833-3
T1033-1
T1433-1
T1433-2
N
6
6
8
8
8
10
14
14
D2
1.50±0.10
1.50±0.10
1.50±0.10
1.50±0.10
1.50±0.10
1.50±0.10
1.70±0.10
1.70±0.10
E2
2.30±0.10
2.30±0.10
2.30±0.10
2.30±0.10
2.30±0.10
2.30±0.10
2.30±0.10
2.30±0.10
e
0.95 BSC
0.95 BSC
0.65 BSC
0.65 BSC
0.65 BSC
0.50 BSC
0.40 BSC
0.40 BSC
JEDEC SPEC
MO229 / WEEA
MO229 / WEEA
MO229 / WEEC
MO229 / WEEC
MO229 / WEEC
MO229 / WEED-3
----
----
b
0.40±0.05
0.40±0.05
0.30±0.05
0.30±0.05
0.30±0.05
0.25±0.05
0.20±0.05
0.20±0.05
[(N/2)-1] x e
1.90 REF
1.90 REF
1.95 REF
1.95 REF
1.95 REF
2.00 REF
2.40 REF
2.40 REF
DOWNBONDS
ALLOWED
NO
NO
NO
NO
YES
NO
YES
NO
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
G
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
? 2005 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.
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