参数资料
型号: MAX8900DEWV+T
厂商: Maxim Integrated Products
文件页数: 26/35页
文件大小: 0K
描述: IC LI BATTERY CHARGER 1.2A WLP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
功能: 充电管理
电池化学: 锂离子(Li-Ion)、锂聚合物(Li-Pol)
电源电压: 3.4 V ~ 6.3 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 30-WFBGA,WLBGA
供应商设备封装: 30-WLP
包装: 带卷 (TR)
MAX8900A/MAX8900B/MAX8900C
1.2A Switch-Mode Li+ Chargers with ±22V Input
Rating and JEITA Battery Temperature Monitoring
A. BASIC THERMISTOR CONFIGURATION
B. ADVANCED THERMISTOR CONFIGURATION
R TB
AVL: E5
AVL
AVL IS THE
INTERNAL
ANALOG SUPPLY
MAX8900_
R TB
AVL: E5
AVL
AVL IS THE
INTERNAL
ANALOG SUPPLY
MAX8900_
THM: E4
THM: E4
R THRM
T
COLD: T1
R TP
R TS
COLD: T1
THERMOMETER
DECODE LOGIC
BAT_T
T
R THRM
THERMOMETER
DECODE LOGIC
BAT_T
COOL: T2
TO DC-DC
CHARGE
CONTROLLER
WARM: T3
HOT: T4
Figure 11. Thermistor Monitor Detail
Thermal Foldback
Thermal foldback maximizes the battery charge current
while regulating the MAX8900_ junction temperature. As
COOL: T2
TO DC-DC
CHARGE
CONTROLLER
WARM: T3
HOT: T4
During shutdown, the step-down charger is off and all
internal blocks except the bias circuitry is turned off. Once
the junction has cooled by 15 N C, the IC resumes operation.
shown in Figure 12, when the die temperature exceeds
T REG , a thermal limiting circuit reduces the battery
charge-current target by A TREG , until the charge cur-
rent reaches 25% of the fast-charge current setting. The
charger maintains 25% of the fast-charge current until
the die temperature reaches T SHDN . Please note that
the MAX8900_ is rated for a maximum ambient tempera-
ture of +85 N C. Furthermore, although the maximum die
temperature of the MAX8900_ is +150 N C, it is common
industry practice to design systems in such a way that
the die temperature never exceeds +125 N C. Limiting the
maximum die temperature to +125 N C extends long-term
reliability.
1.4
1.2
1.0
0.8
0.6
0.4
0.2
CHARGE CURRENT
vs. JUNCTION TEMPERATURE
T2 < V THM < T3
I FC = 1.19A
I FC = 0.756A
Thermal Shutdown
As shown in Figure 12, when the MAX8900_ die tempera-
ture exceeds T SHDN , the IC goes into thermal shutdown.
0
50
75
100 125
T J (°C)
150
175
Figure 12. Charge Current vs. Junction Temperature
26
Maxim Integrated
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