参数资料
型号: MAX9670CTL+T
厂商: Maxim Integrated Products
文件页数: 12/44页
文件大小: 0K
描述: IC AUDIO/VIDEO SWIT DUAL 40TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
功能: 音频/视频切换
电路: 2 x SCART
电压电源: 单电源
电压 - 电源,单路/双路(±): 3.3 V ~ 12 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 40-WFQFN 裸露焊盘
供应商设备封装: 40-TQFN-EP(6x6)
包装: 带卷 (TR)
配用: MAX9670EVKIT+-ND - EVALUATION KIT FOR MAX9670
MAX9670/MAX9671
Low-Power Audio/Video Switch with Audio
Volume Control for Dual SCART Connectors
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V12 = 12V, VVID = VAUD = 3.3V, VGNDVID = VEP = 0V, no load, TA = 0°C to +70°C, unless otherwise noted. Typical values are at
TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VVID to GNDVID........................................................-0.3V to +4V
V12 to EP.................................................................-0.3V to +14V
VAUD to EP ...............................................................-0.3V to +4V
EP to GNDVID .......................................................-0.1V to +0.1V
All Video Inputs, VCRIN_FS to GNDVID...................-0.3V to +4V
All Audio Inputs to EP .......................................-1V to (VEP + 1V)
SDA, SCL, DEV_ADDR, INT to GNDVID ..................-0.3V to +4V
TV_SS, VCR_SS to EP .................................-0.3V to (V12 + 0.3V)
Current
All Video/Audio Inputs ...................................................±20mA
C1P, C1N, CPVSS .........................................................±50mA
Output Short-Circuit Current Duration
Video and Fast-Switching Outputs to VVID,
GNDVID.................................................................Continuous
Audio Outputs to VAUD, EP .....................................Continuous
TV_SS, VCR_SS to V12, EP......................................Continuous
Continuous Power Dissipation (TA = +70°C)
40-Pin TQFN-EP (derate 26.3mW/°C above +70°C) ...2105.3mW
44-Pin TQFN-EP (derate 26.3mW/°C above +70°C)...2222.2mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
40/44-pin TQFN-EP .........................................................1°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
40/44-pin TQFN-EP .......................................................27°C/W
Operating Temperature Range...............................0°C to +70°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Video Supply Voltage Range
VVID
Inferred from video PSRR test at 3V and
3.6V
3
3.3
3.6
V
Audio Supply Voltage Range
VAUD
Inferred from audio PSRR test at 3V and
3.6V
3
3.3
3.6
V
V12 Supply Voltage Range
V12
Inferred from slow-switching levels
11.4
12
12.6
V
Normal operation; all video output
amplifiers are enabled and muted (Note 3)
16
30
mA
Standby mode, slow switch inputs low
1500
VVID Quiescent Supply Current
IVID_Q
Shutdown
35
A
Normal operation (Note 3)
3.2
6
mA
VAUD Quiescent Supply Current
IAUD_Q
Shutdown
35
A
Slow-switching output
set to low-level
0.3
100
Normal operation
(Note 3)
Slow-switching output
set to medium-level
475
A
V12 Quiescent Supply Current
I12_Q
Shutdown, TA = +25°C
10
A
VIDEO CHARACTERISTICS
DC-COUPLED INPUT
VVID = 3V
1.15
VVID = 3.135V
1.15
Input Voltage Range
VIN
RL = 75
to
GNDVID or 150
to VVID/2; inferred
from gain test
VVID = 3.3V
1.3
VP-P
Input Current
IIN
VIN = 0.3V, TA = +25°C
1
2
A
Input Resistance
RIN
300
k
Note 1: Package thermal resistance were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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