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参数资料
| 型号： | MAXQ610X-0000+ |
| 厂商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, UUC |
| 封装： | DIE |
| 文件页数： | 15/29页 |
| 文件大小： | 827K |
| 代理商： | MAXQ610X-0000+ |
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MAXQ610
16-Bit Microcontroller with Infrared Module
22
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Operating Modes
The lowest power mode of operation for the MAXQ610
is stop mode. In this mode, CPU state and memories
are preserved, but the CPU is not actively running.
Wake-up sources include external I/O interrupts, the
power-fail warning interrupt, or a power-fail reset. Any
time the microcontroller is in a state where code does
not need to be executed, the user software can put the
MAXQ610 into stop mode. The nanopower ring oscilla-
tor is an internal ultra-low-power (400nA), 8kHz ring
oscillator that can be used to drive a wake-up timer that
exits stop mode. The wake-up timer is programmable
by software in steps of 125s up to approximately 8s.
The power-fail monitor is always on during normal oper-
ation. However, it can be selectively disabled during
stop mode to minimize power consumption. This fea-
ture is enabled using the power-fail monitor disable
(PFD) bit in the PWCN register. The reset default state
for the PFD bit is 1, which disables the power-fail moni-
tor function during stop mode. If power-fail monitoring
is disabled (PFD = 1) during stop mode, the circuitry
responsible for generating a power-fail warning or reset
is shut down and neither condition is detected. Thus,
the VDD < VRST condition does not invoke a reset state.
However, in the event that VDD falls below the POR
level, a POR is generated. The power-fail monitor is
enabled prior to stop mode exit and before code exe-
cution begins. If a power-fail warning condition (VDD <
VPFW) is then detected, the power-fail interrupt flag is
set on stop mode exit. If a power-fail condition is
detected (VDD < VRST), the CPU goes into reset.
Power-Fail Detection
Figures 11, 12, and 13 show the power-fail detection
and response during normal and stop mode operation.
A
B
C
D
F
G
H
I
E
VDD
VPFW
VRST
VPOR
INTERNAL RESET
(ACTIVE HIGH)
t < tPFW
t
≥ tPFW
t
≥ tPFW
t
≥ tPFW
Figure 11. Power-Fail Detection During Normal Operation
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAXQ610X-0000+ | 功能描述:MCU 16BIT W/IR MODULE BARE DIE RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MAXQ® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:260 系列:73S12xx 核心处理器:80515 芯体尺寸:8-位 速度:24MHz 连通性:I²C，智能卡，UART/USART，USB 外围设备:LED，POR，WDT 输入/输出数:9 程序存储器容量:64KB（64K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:2K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-VFQFN 裸露焊盘 包装:管件 |
| MAXQ610X-0001+ | 功能描述:MAXQ610X PROG TESTED DIE WAFFLE RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MAXQ® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:260 系列:73S12xx 核心处理器:80515 芯体尺寸:8-位 速度:24MHz 连通性:I²C，智能卡，UART/USART，USB 外围设备:LED，POR，WDT 输入/输出数:9 程序存储器容量:64KB（64K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:2K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-VFQFN 裸露焊盘 包装:管件 |
| MAXQ610X-2001+ | 功能描述:16位微控制器 - MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MAXQ610X-2021+ | 制造商:Maxim Integrated Products 功能描述:16-BIT MICROCONTROLLER WITH INFRARED MODULE - Gel-pak, waffle pack, wafer, diced wafer on film |
| MAXQ610X-UEI+ | 制造商:Maxim Integrated Products 功能描述:MAXQ610 BLANK WLP UEI - Gel-pak, waffle pack, wafer, diced wafer on film |
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