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参数资料
| 型号： | MAXQ610X-0000+ |
| 厂商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, UUC |
| 封装： | DIE |
| 文件页数： | 16/29页 |
| 文件大小： | 827K |
| 代理商： | MAXQ610X-0000+ |
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MAXQ610
16-Bit Microcontroller with Infrared Module
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23
If a reset is caused by a power-fail, the power-fail moni-
tor can be set to one of the following intervals:
Always on—continuous monitoring
211 nanopower ring oscillator clocks (~256ms)
212 nanopower ring oscillator clocks (~512ms)
213 nanopower ring oscillator clocks (~1.024s)
In the case where the power-fail circuitry is periodically
turned on, the power-fail detection is turned on for two
nanopower ring oscillator cycles. If VDD > VRST during
detection, VDD is monitored for an additional nanopow-
er ring oscillator period. If VDD remains above VRST for
the third nanopower ring period, the CPU exits the reset
state and resumes normal operation from utility ROM at
8000h after satisfying the crystal warmup period.
If a reset is generated by any other event, such as the
RESET pin being driven low externally or the watchdog
timer, the power-fail, internal regulator, and crystal
remain on during the CPU reset. In these cases, the
CPU exits the reset state in less than 20 crystal cycles
after the reset source is removed.
STATE
POWER-FAIL
INTERNAL
REGULATOR
CRYSTAL
OSCILLATOR
SRAM
RETENTION
COMMENTS
A
On
Off
—
VDD < VPOR.
B
On
—
VPOR < VDD < VRST.
Crystal warmup time, tXTAL_RDY.
CPU held in reset.
C
On
—
VDD > VRST.
CPU normal operation.
D
On
—
Power drop too short.
Power-fail not detected.
E
On
—
VRST < VDD < VPFW.
PFI is set when VRST < VDD < VPFW and maintains
this state for at least tPFW, at which time a power-
fail interrupt is generated (if enabled).
CPU continues normal operation.
F
On
(Periodically)
Off
Yes
VPOR < VDD < VRST.
Power-fail detected.
CPU goes into reset.
Power-fail monitor turns on periodically.
G
On
—
VDD > VRST.
Crystal warmup time, tXTAL_RDY.
CPU resumes normal operation from 8000h.
H
On
(Periodically)
Off
Yes
VPOR < VDD < VRST.
Power-fail detected.
CPU goes into reset.
Power-fail monitor is turned on periodically.
I
Off
—
VDD < VPOR.
Device held in reset.
No operation allowed.
Table 4. Power-Fail Detection States During Normal Operation
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAXQ610X-0000+ | 功能描述:MCU 16BIT W/IR MODULE BARE DIE RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MAXQ® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:260 系列:73S12xx 核心处理器:80515 芯体尺寸:8-位 速度:24MHz 连通性:I²C，智能卡，UART/USART，USB 外围设备:LED，POR，WDT 输入/输出数:9 程序存储器容量:64KB（64K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:2K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-VFQFN 裸露焊盘 包装:管件 |
| MAXQ610X-0001+ | 功能描述:MAXQ610X PROG TESTED DIE WAFFLE RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MAXQ® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:260 系列:73S12xx 核心处理器:80515 芯体尺寸:8-位 速度:24MHz 连通性:I²C，智能卡，UART/USART，USB 外围设备:LED，POR，WDT 输入/输出数:9 程序存储器容量:64KB（64K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:2K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-VFQFN 裸露焊盘 包装:管件 |
| MAXQ610X-2001+ | 功能描述:16位微控制器 - MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MAXQ610X-2021+ | 制造商:Maxim Integrated Products 功能描述:16-BIT MICROCONTROLLER WITH INFRARED MODULE - Gel-pak, waffle pack, wafer, diced wafer on film |
| MAXQ610X-UEI+ | 制造商:Maxim Integrated Products 功能描述:MAXQ610 BLANK WLP UEI - Gel-pak, waffle pack, wafer, diced wafer on film |
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