参数资料
型号: MC33389
厂商: 飞思卡尔半导体(中国)有限公司
英文描述: System Basis Chip with Low Speed Fault Tolerant CAN(带低速容错CAN接口的系统基片)
中文描述: 系统基础芯片与低速容错CAN(带低速容错的CAN接口的系统基片)
文件页数: 10/35页
文件大小: 591K
代理商: MC33389
MC33389
10
MC33389
Thermal Management
The MC33389 is proposed in two different packages.
HSOP20 for high power applications and SO28WB with 8 pins
to the leadframe for medium power applications.
HSOP20 Package
For such a package, the heat flow is mainly vertical and
each heat source (dissipating element) can be seen as an
independent thermal resistance to the Heatsink. The thermal
network can be roughly depicted as:
Figure 2. HSOP20 Simplified Thermal Model
Example
Assuming I
V1
=100mA at V
bat
=16V,
I
V2
=150mA at V
bat
=16V (Excluding CAN consumption).
I
CAN
=50mA at V
bat
=16V, we have :
P
V1
=1.1W, P
V2
=1.65W, P
can
=0.55W
System assumptions:
If T
amb
=85°C and R
thc/a
=18°C/W, this gives:
T
case
=T
amb
+R
th c/a
x 3.3W = 85+18 x 3.3=145°C
and T
j
V1=T
j
V2=T
jcan
=155°C.
This example represents the limit for the maximum power
dissipations with a HSOP20.
T
ambient
T
case
(heatsink)
V1 power
V2 power
Can power
T
j
(max 155°C)
R
thj/c
=18°C/W
6.5°C/W
9°C/W
R
thc/a
(ECU supplier dependent)
SO28WB Package
The case(pin) to junction R
th
is here represented by only
one thermal resistance for the total power since the 3 power
sources strongly interact on the silicon for such a package.
Figure 3. SO28WB Simplified Thermal Model
Example
Assuming I
V1
=45mA at V
bat
=16V,
I
V2
=45mA at V
bat
=16V (Excluding CAN consumption).
I
CAN
=50mA at V
bat
=16V, we have :
P
V1
=0.5W, P
V2
=0.5W, P
can
=0.55W thus P
total
=1.55W
System assumptions:
If T
amb
=85°C and R
thc/a
=25°C/W, this gives:
T
case
=T
amb
+R
thc/a
x 1.55W=85+25x1.55 =124°C
and T
j
V1=124 + 20 x 1.55= 155°C.
This example represents the limit for the maximum power
dissipations with a SO28WB.
T
case
(pin)
T
j
(max 155°C)
Total power
R
thc/a
T
ambient
R
thj/c
=20°C/W
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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