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参数资料
型号： MC33394
厂商： 飞思卡尔半导体(中国)有限公司
元件分类： CAN
英文描述： Switch Mode Power Supply with Multiple Linear Regulators and High Speed CAN Transceiver(带有多个线性稳压器和高速CAN收发器的开关方式电源)
中文描述： 开关电源的多线性稳压器和高速CAN收发器（带有多个线性稳压器和高速的CAN收发器的开关方式电源）
文件页数： 6/44页
文件大小： 641K
代理商： MC33394
6
Go to: www.freescale.com
1. MAXIMUM RATINGS
(Maximum Ratings indicate sustained limits beyond which damage to the device may occur.
Voltage parameters are absolute voltages referenced to ground.)
Parameter
Min.
–0.3
–18
–0.3
–2.0
–18
Max.
+45
+45
+5.8
+18
+26.5
Unit
V
V
V
V
V
Supply Voltage (VBAT), Load Dump
Supply Voltage (KA_VBAT, VIGN), Load Dump
Supply Voltages (VDDH, VPP, VDD3_3, VDDL, VKAM)
Supply Voltages (VREF1, VREF2, VREF3, VSEN)
CANL, CANH (0<VBAT<18 VDC no time limit)
ESD Voltage
Human Body Model all pins
Machine Model all pins
CANLesd, CANHesd
CANLesd, CANHesd
CANLtransient, CANHtransient
/SLEEP
REGON, VPP_EN, /HRESET, /PORESET, /PRERESET, HRT, DO, DI, CS, SCLK
CANTXD, CANRXD
Operational Package Temperature [Ambient Temperature]
Storage Temperature
Power Dissipation (TA = 125 C)
44 HSOP
44 QFN
54 SOICW–EP
Lead Soldering Temperature
Maximum Junction Temperature
R
θ
JA, Thermal Resistance, Junction to Ambient (44 HSOP)
R
θ
JC, Thermal Resistance, Junction to Case (44 HSOP)
R
θ
JB, Thermal Resistance, Junction to Base (44 HSOP)
R
θ
JA, Thermal Resistance, Junction to Ambient (44 QFN)
R
θ
JC, Thermal Resistance, Junction to Case (44 QFN)
R
θ
JB, Thermal Resistance, Junction to Base (44 QFN)
R
θ
JA, Thermal Resistance, Junction to Ambient (54 SOICW–EP)
R
θ
JC, Thermal Resistance, Junction to Case (54 SOICW–EP)
R
θ
JB, Thermal Resistance, Junction to Base (54 SOICW–EP)
1. Human body model: C = 100 pF, R = 1.5 k
.
2. Machine model: C = 200 pF, R = 10
and L = 0.75
μ
H. In case of a discharge from pin CANL to pin GND: – 100 V < CANL transient < +100
V; in case of a discharge from pin CANH to Vcc: –150 V < CANH transient < +150 V.
3. The waveforms of the applied transients is in accordance with ”ISO 7637 part 1” test pulses 1, 2, 3a and 3b.
4. Maximum power dissipation at indicated junction temperature.
5. Lead soldering temperature limit is for 10 seconds maximum duration; contact Motorola Sales Office for device immersion soldering
time/temperature limits.
6. Thermal resistance measured in accordance with EIA/JESD51–2.
7. Theoretical thermal resistance from the die junction to the exposed pad.
8. Thermal resistance measured in accordance with JESD51–8.
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 3)
–2.0
–200
–4.0
–200
–200
–18
–0.3
–0.3
–40
–65
+2.0
+200
+4.0
+200
+200
+45
+7.0
+7.0
+125
+150
kV
V
kV
V
V
V
V
V
°
C
°
C
(Note 4)
(Note 4)
(Note 4)
(Note 5)
8.3
5.0
5.0
260
+150
41
0.2
3
77
1.7
5.0
52
1.2
8.1
W
W
W
C
°
C
(Note 6)
(Note 7)
(Note 8)
(Note 6)
(Note 7)
(Note 8)
(Note 6)
(Note 7)
(Note 8)
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
2. RECOMMENDED OPERATING CONDITIONS
(
All voltages are with respect to ground unless otherwise noted)
Parameter
Value
Unit
Supply Voltages (VBAT, KA_VBAT)
Switching Regulator Output Current (IVPRE)
VDDH Output Current
VDD3_3 Output Current
VDDL_B Pass Transistor Base Drive Current
VPP Output Current
VREF Output Current
VSEN Output Current
VKAM Standby Output Current (normal mode of operation)
VKAM Standby Output Current (standby mode of operation)
1. See Typical Application Diagram in Figure 1.
4.0 to 26.5
0 to 1.2
0 to 400
0 to 120
0 to 40
0 to 150
0 to 100
0 to 125
0 to 60
0 to 12
V
A
(Note 1)
mA
mA
mA
mA
mA
mA
mA
mA
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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