参数资料
型号: MC33780EG
厂商: Freescale Semiconductor
文件页数: 36/37页
文件大小: 0K
描述: IC DBUS MASTER DUAL DIFF 16-SOIC
标准包装: 47
系列: *
类型: *
应用: *
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC W
包装: 管件
Analog Integrated Circuit Device Data
8
Freescale Semiconductor
33780
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
BUS TRANSMITTER
Idle-to-Signal and Signal-to-Idle Slew Rate (12
≤ V
SUP ≤ 25 V)
tSLEW(IDLE)
2.0
4.5
8.0
V/
s
Signal High-to-Low and Signal Low-to-High Slew Rate (10), (13)
(See Data Valid DSIS to DnD Timing)
tSLEW(SIGNAL)
3.0
4.5
8.0
V/
s
Communication Data Rate Capability (13) (Ensured by Transmitter Data
Valid and Receiver Delay Measurements)
DRATE
150
kbps
Signal Bit Time (1 / DRATE)
tBIT
6.67
s
INT
Turn ON Delay, DBUS Transaction End to Receive FIFO
INT
tINTON
1/3 * tBIT
+0.2
s
INT
Turn ON Delay (C = 100 pF) (12)
CS
to INT Low
tINTON
0.2
s
INT
Turn OFF Delay, CS/SCLK Rising Edge to INT High
tINTOFF
0.2
s
DBUS Start Delay, CS/SCLK Rising Edge to DBUS (11), (13), (15)
Spread Spectrum Mode Disabled
Spread Spectrum Mode Enabled
tDBUSSTART1
tDBUSSTART2
1/3 * tBIT
2/3 * tBIT
4/3 * tBIT
s
Data Valid (10), (12)
DSIF (CS) = 0.5 * VCC to DnD Fall = 5.5 V
DSIS (MOSI) = 0.5 * VCC to DnD Fall = 0.2 * VDnD
DSIS (MOSI) = 0.5 * VCC to DnD Rise = 0.8 * VDnD
DSIF (CS) = 0.5 * VCC to DnD Rise = 6.5 V
tDVLD1
tDVLD2
tDVLD3
tDVLD4
0.25
6.0
0.8
6.56
1.3
s
Signal Driver Overcurrent Shutdown Delay
tOC
2.0
20
s
Signal Low Time for Logic Zero
33.3% Duty Cycle (16)
t0LO
2/3 * tBIT-0.8 2/3 * tBIT-0.6 2/3 * tBIT-0.4
s
Signal Low Time for Logic One
66.7% Duty Cycle (16)
t1LO
1/3 * tBIT-0.8 1/3 * tBIT-0.6 1/3 * tBIT-0.4
s
Notes
10
C = 7.5 nF from DnH to DnL and 4.7 nF from DnH and DnL to GND, capacitor tolerance = ±10%.
11
In the case where the SPI write to DnL (initiating a DBUS transaction start or causing an interrupt) is the last byte in the burst sequence,
timing is from rising edge of CS. Otherwise, timing is from the first SCLK rising edge of the next SPI burst byte.
12
Delays are measured in test mode to determine the delay for analog signal paths.
13
Not measured in production.
14
V
DnD = VDnD(HIGH) - VDnD(LOW).
15
Internal digital delay only.
16
Guaranteed by design.
Table 4. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V
≤ V
CC ≤ 5.25 V, 9.0 V ≤ VSUP ≤ 25 V, - 40°C ≤ T
A ≤ 85°C unless otherwise
noted. Voltages relative to GND unless otherwise noted. Typical values noted reflect the approximate parameter means at
TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
相关PDF资料
PDF描述
MC33790DW IC DSI 2-CHAN INTERFACE 16-SOIC
MC33794EKR2 IC SENSOR ELECTRIC FIELD 54SOICW
MC33889BDW IC SYSTEM BASE W/CAN 28-SOIC
MC33889DPEG IC SYSTEM BASE W/CAN 28SOIC
MC33972TEWR2 IC SWITCH DETECT SPI 32-SOIC
相关代理商/技术参数
参数描述
MC33780EGR2 功能描述:IC DBUS MASTER DUAL DIFF 16-SOIC RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
MC33790DW 功能描述:IC DSI 2-CHAN INTERFACE 16-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 传感器和探测器接口 系列:- 其它有关文件:Automotive Product Guide 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:74 系列:- 类型:触控式传感器 输入类型:数字 输出类型:数字 接口:JTAG,串行 电流 - 电源:100µA 安装类型:表面贴装 封装/外壳:20-TSSOP(0.173",4.40mm 宽) 供应商设备封装:20-TSSOP 包装:管件
MC33790HEG 功能描述:接口 - 专用 DISTRIB SYS INTRFC RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59
MC33790HEGR2 功能描述:接口 - 专用 DISTRIB SYS INTRFC RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59
MC33793D 功能描述:IC DSI SLAVE FOR R-SENSE 16-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 传感器和探测器接口 系列:- 其它有关文件:Automotive Product Guide 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:74 系列:- 类型:触控式传感器 输入类型:数字 输出类型:数字 接口:JTAG,串行 电流 - 电源:100µA 安装类型:表面贴装 封装/外壳:20-TSSOP(0.173",4.40mm 宽) 供应商设备封装:20-TSSOP 包装:管件