参数资料
型号: MC33912BAC
厂商: Freescale Semiconductor
文件页数: 53/95页
文件大小: 0K
描述: IC SYSTEM BASIS CHIP 32LQFP
标准包装: 250
应用: 系统基础芯片
电流 - 电源: 4.5mA
电源电压: 5.5 V ~ 27 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 32-LQFP
供应商设备封装: 32-LQFP(7x7)
包装: 托盘
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 34. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RATINGS
Thermal Resistance, Junction to Case
Operating Ambient Temperature (82)
Operating Junction Temperature
Storage Temperature
Thermal Resistance, Junction to Ambient
Natural Convection, Single Layer board (1s) (83), (84)
Natural Convection, Four Layer board (2s2p) (83), (85)
33912
34912
T A
T J
T STG
R ? JA
R ? JC
-40 to 125
-40 to 85
-40 to 150
-55 to 150
85
56
23
? C
? C
? C
? C/W
? C/W
Peak Package Reflow Temperature During
Reflow (87), (88)
T PPRT
°C
Notes
82. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
83.
84.
85.
86.
87.
88.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
33912
Analog Integrated Circuit Device Data ?
Freescale Semiconductor
53
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