参数资料
型号: MC56F8122VFAE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 数字信号处理
英文描述: 0-BIT, 80 MHz, OTHER DSP, PQFP48
封装: ROHS COMPLIANT, LQFP-48
文件页数: 36/136页
文件大小: 719K
代理商: MC56F8122VFAE
56F8322 Techncial Data, Rev. 16
130
Freescale Semiconductor
Preliminary
Figure 11-3 48-Pin LQFP Mechanical Information
Please see www.freescale.com for the most current case outline.
A
A1
Z
0.200 AB T-U
4X
Z
0.200 AC T-U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
P
AE
T, U, Z
DETAIL Y
BASE METAL
N
J
F
D
T-U
M
0.080
Z
AC
SECTION AE-AE
AD
G
0.080 AC
M°
TOP & BOTTOM
L °
W
K
AA
E
C
H
0.2
50
R
9
DETAIL AD
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
CONTROLLING DIMENSION: MILLIMETER.
3.
DATUM PLANE AB IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4.
DATUMS T, U, AND Z TO BE DETERMINED AT DATUM
PLANE AB.
5.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.250
PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM PLANE
AB.
7.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.350.
8.
MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
T
U
Z
AB
AC
GAUGE
P
LAN
E
DIM
A
MIN
MAX
7.000 BSC
MILLIMETERS
A1
3.500 BSC
B
7.000 BSC
B1
3.500 BSC
C
1.400
1.600
D
0.170
0.270
E
1.350
1.450
F
0.170
0.230
G
0.500 BSC
H
0.050
0.150
J
0.090
0.200
K
0.500
0.700
M
12 REF
N
0.090
0.160
P
0.250 BSC
L
0
7
R
0.150
0.250
S
9.000 BSC
S1
4.500 BSC
V
9.000 BSC
V1
4.500 BSC
W
0.200 REF
AA
1.000 REF
°
°°
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