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参数资料
型号： MC56F8357VPY60
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 数字信号处理
英文描述： 16-BIT, 120 MHz, OTHER DSP, PQFP160
封装： PLASTIC, LQFP-160
文件页数： 39/177页
文件大小： 4091K
代理商： MC56F8357VPY60
General Characteristics
56F8357 Technical Data, Rev. 15
Freescale Semiconductor
133
Preliminary
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
mal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (
ΨJT ), is the "resistance" from junction to reference point thermocouple on top cen-
ter of case as defined in JESD51-2.
ΨJT is a useful value to use to estimate junction temperature in steady state customer envi-
ronments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipaion of other components on the board, and board thermal resistance.
6. See Part 12.1 for more details on thermal design considerations.
7. TJ = Junction temperature
TA = Ambient temperature
TBD = numbers will be available late Q4 2005
Table 10-2 56F8357/56F8157 ElectroStatic Discharge (ESD) Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
V
ESD for Machine Model (MM)
200
—
V
ESD for Charge Device Model (CDM)
500
—
V
Table 10-3 Thermal Characteristics6
Characteristic
Comments
Symbol
Value
Unit
Notes
160-pin LQFP
160MAPBGA
Junction to ambient
Natural convection
RθJA
38.5
39.90
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
35.4
46.8
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
33
TBD
°C/W
1, 2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
(2s2p)
31.5
TBD
°C/W
1, 2
Junction to case
RθJC
8.6
TBD
°C/W
3
Junction to center of case
ΨJT
0.8
TBD
°C/W
4, 5
I/O pin power dissipation
P I/O
User-determined
W
Power dissipation
P D
P D = (IDD x VDD + P I/O)W
Maximum allowed PD
PDMAX
(TJ - TA) / R
θJA7
W
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MC56F8357,
MC56F8157
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