参数资料
型号: MC9328MX1DVM20
厂商: Freescale Semiconductor
文件页数: 74/100页
文件大小: 0K
描述: IC MCU I.MX 200MHZ 256-MAPBGA
标准包装: 152
系列: i.MX1
核心处理器: ARM9
芯体尺寸: 32-位
速度: 200MHz
连通性: EBI/EMI,I²C,MMC,智能卡,SPI,SSI,UART/USART,USB
外围设备: DMA,I²S,LCD,POR,PWM,WDT
输入/输出数: 110
程序存储器类型: ROMless
电压 - 电源 (Vcc/Vdd): 1.7 V ~ 3.3 V
振荡器型: 外部
工作温度: -30°C ~ 70°C
封装/外壳: 256-MAPBGA
包装: 托盘
Functional Description and Application Information
MC9328MX1 Technical Data, Rev. 7
Freescale Semiconductor
75
Figure 54. SDIO ReadWait Timing Diagram
4.11
Memory Stick Host Controller
The Memory Stick protocol requires three interface signal line connections for data transfers: MS_BS,
MS_SDIO, and MS_SCLKO. Communication is always initiated by the MSHC and operates the bus in
either four-state or two-state access mode.
The MS_BS signal classifies data on the SDIO into one of four states (BS0, BS1, BS2, or BS3) according
to its attribute and transfer direction. BS0 is the INT transfer state, and during this state no packet
transmissions occur. During the BS1, BS2, and BS3 states, packet communications are executed. The BS1,
BS2, and BS3 states are regarded as one packet length and one communication transfer is always
completed within one packet length (in four-state access mode).
The Memory Stick usually operates in four state access mode and in BS1, BS2, and BS3 bus states. When
an error occurs during packet communication, the mode is shifted to two-state access mode, and the BS0
and BS1 bus states are automatically repeated to avoid a bus collision on the SDIO.
DAT[1]
For 4-bit
DAT[2]
For 4-bit
CMD
******
P S T
E Z Z
******
CMD52
Z
CRC
E Z Z
S
Block Data
L L L L L L L L L L L L L L L L L L L L L H Z S
E
S
Block Data
E
Block Data
Z Z L H
E
S
Block Data
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MC9328MX1VH20 功能描述:IC MCU I.MX 200MHZ 256-MAPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:i.MX1 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN,SCI,SPI 外围设备:POR,PWM,温度传感器,WDT 输入/输出数:21 程序存储器容量:40KB(20K x 16) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323