参数资料
型号: MC9RS08KA2CDB
厂商: Freescale Semiconductor
文件页数: 14/136页
文件大小: 0K
描述: IC MCU 8-BIT 2K FLASH 6-DFN
产品培训模块: Mechatronics
USBSpyder08 Discovery Kit
RS08KA2 Low-End Microcontroller Series
MC9RS08KA8 Microcontroller
标准包装: 490
系列: RS08
核心处理器: RS08
芯体尺寸: 8-位
速度: 10MHz
外围设备: LVD,POR,WDT
输入/输出数: 2
程序存储器容量: 2KB(2K x 8)
程序存储器类型: 闪存
RAM 容量: 63 x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 5.5 V
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 6-VDFN 裸露焊盘
包装: 托盘
产品目录页面: 726 (CN2011-ZH PDF)
配用: DEMO9RS08KA2-ND - DEMO BOARD FOR 9RS08KA2
Appendix A Electrical Characteristics
MC9RS08KA2 Series Data Sheet, Rev. 4
110
Freescale Semiconductor
A.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. A-1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
Table A-2. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJMAX
105
°C
Thermal resistance 1,2,3,4
6-pin DFN
1s
2s2p
8-pin PDIP
1s
2s2p
8-pin SOIC
1s
2s2p
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance,
mounting site (board) temperature, ambient temperature, air flow, power dissipation of other
components on the board, and board thermal resistance.
2 Junction to Ambient Natural Convection
3 1s - Single Layer Board, one signal layer
4 2s2p - Four Layer Board, 2 signal and 2 power layers
θ
JA
225
53
115
74
160
98
°C/W
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MC9RS08KA2DB 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontrollers
MC9RS08KA2PC 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontrollers