参数资料
型号: MCF5274LCVM166
厂商: Freescale Semiconductor
文件页数: 4/44页
文件大小: 0K
描述: IC MCU 32BIT 166MHZ 196-MAPBGA
标准包装: 126
系列: MCF527x
核心处理器: Coldfire V2
芯体尺寸: 32-位
速度: 166MHz
连通性: EBI/EMI,以太网,I²C,SPI,UART/USART,USB
外围设备: DMA,WDT
输入/输出数: 69
程序存储器类型: ROMless
RAM 容量: 64K x 8
电压 - 电源 (Vcc/Vdd): 1.4 V ~ 1.6 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 196-LBGA
包装: 托盘
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Design Recommendations
Freescale Semiconductor
12
5.7
Interface Recommendations
5.7.1
DDR SDRAM Controller
5.7.1.1
SDRAM Controller Signals in Synchronous Mode
Table 3 shows the behavior of SDRAM signals in synchronous mode.
5.7.1.2
Address Multiplexing
See the SDRAM controller module chapter in the MCF5275 Reference Manual for details on address
multiplexing.
5.7.2
Ethernet PHY Transceiver Connection
The FEC supports an MII interface for 10/100 Mbps Ethernet and a seven-wire serial interface for 10 Mbps
Ethernet. The interface mode is selected by R_CNTRL[MII_MODE]. In MII mode, the 802.3 standard
defines and the FEC module supports 18 signals. These are shown in Table 4.
Table 3. Synchronous DRAM Signal Connections
Signal
Description
SD_SRAS
Synchronous row address strobe. Indicates a valid SDRAM row address is present and can be
latched by the SDRAM. SD_SRAS should be connected to the corresponding SDRAM
SD_SRAS. Do not confuse SD_SRAS with the DRAM controller’s SDRAM_CS[1:0], which
should not be interfaced to the SDRAM SD_SRAS signals.
SD_SCAS
Synchronous column address strobe. Indicates a valid column address is present and can be
latched by the SDRAM. SD_SCAS should be connected to the corresponding signal labeled
SD_SCAS on the SDRAM.
SD_WE
DRAM read/write. Asserted for write operations and negated for read operations.
SD_CS[1:0]
Row address strobe. Select each memory block of SDRAMs connected to the MCF5275. One
SDRAM_CS signal selects one SDRAM block and connects to the corresponding CS signals.
SD_CKE
Synchronous DRAM clock enable. Connected directly to the CKE (clock enable) signal of
SDRAMs. Enables and disables the clock internal to SDRAM. When CKE is low, memory can
enter a power-down mode where operations are suspended or they can enter self-refresh
mode. SD_CKE functionality is controlled by DCR[COC]. For designs using external
multiplexing, setting COC allows SD_CKE to provide command-bit functionality.
BS[3:2]
Column address strobe. For synchronous operation, BS[3:2] function as byte enables to the
SDRAMs. They connect to the DQM signals (or mask qualifiers) of the SDRAMs.
DDR_CLKOUT
Bus clock output. Connects to the CLK input of SDRAMs.
Table 4. MII Mode
Signal Description
MCF5275 Pin
Transmit clock
FECn_TXCLK
Transmit enable
FECn_TXEN
Transmit data
FECn_TXD[3:0]
Transmit error
FECn_TXER
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