参数资料
型号: MCIMX351AVM4BR2
厂商: Freescale Semiconductor
文件页数: 104/147页
文件大小: 0K
描述: IC MPU I.MX35 400MAPBGA
标准包装: 1,000
系列: i.MX35
核心处理器: ARM11
芯体尺寸: 32-位
速度: 400MHz
连通性: 1 线,CAN,EBI/EMI,以太网,I²C,MMC,SPI,SSI,UART/USART,USB OTG
外围设备: DMA,I²S,LCD,POR,PWM,WDT
输入/输出数: 96
程序存储器类型: ROMless
RAM 容量: 128K x 8
电压 - 电源 (Vcc/Vdd): 1.22 V ~ 1.47 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 400-LFBGA
包装: 带卷 (TR)
i.MX35 Applications Processors for Automotive Products, Rev. 10
Freescale Semiconductor
6
The i.MX35 core is intended to operate at a maximum frequency of 532 MHz to support the required
multimedia use cases. Furthermore, an image processing unit (IPU) is integrated into the AP domain to
offload the ARM11 core from performing functions such as color space conversion, image rotation and
scaling, graphics overlay, and pre- and post-processing.
The functionality of AP Domain peripherals includes the user interface; the connectivity, display, security,
and memory interfaces; and 128 Kbytes of multipurpose SRAM.
2.2
Shared Domain Overview
The shared domain is composed of the shared peripherals, a smart DMA engine (SDMA) and a number of
miscellaneous modules. For maximum flexibility, some peripherals are directly accessible by the SDMA
engine.
The i.MX35 has a hierarchical memory architecture including L1 caches and a unified L2 cache. This
reduces the bandwidth demands for the external bus and external memory. The external memory
subsystem supports a flexible external memory system, including support for SDRAM (SDR, DDR2 and
mobile DDR) and NAND Flash.
2.3
Advanced Power Management Overview
To address the continuing need to reduce power consumption, the following techniques are incorporated
in the i.MX35:
Clock gating
Power gating
Power-optimized synthesis
Well biasing
The insertion of gating into the clock paths allows unused portions of the chip to be disabled. Because
static CMOS logic consumes only leakage power, significant power savings can be realized.
“Well biasing” is applying a voltage that is greater than VDD to the nwells, and one that is lower than VSS
to the pwells. The effect of applying this well back bias voltage reduces the subthreshold channel leakage.
For the 90-nm digital process, it is estimated that the subthreshold leakage is reduced by a factor of ten
over the nominal leakage. Additionally, the supply voltage for internal logic can be reduced from 1.4 V to
1.22 V.
2.4
ARM11 Microprocessor Core
The CPU of the i.MX35 is the ARM1136JF-S core, based on the ARM v6 architecture. This core supports
the ARM Thumb instruction sets, features Jazelle technology (which enables direct execution of Java
byte codes) and a range of SIMD DSP instructions that operate on 16-bit or 8-bit data values in 32-bit
registers.
The ARM1136JF-S processor core features are as follows:
Integer unit with integral EmbeddedICE logic
Eight-stage pipeline
相关PDF资料
PDF描述
VI-B6V-IW-B1 CONVERTER MOD DC/DC 5.8V 100W
VI-2N3-IY-F3 CONVERTER MOD DC/DC 24V 50W
MCIMX351AJQ5CR2 MULTIMEDIA PROCESSOR 400-MAPBGA
VI-B5M-IX-B1 CONVERTER MOD DC/DC 10V 75W
VI-2N2-IY-F2 CONVERTER MOD DC/DC 15V 50W
相关代理商/技术参数
参数描述
MCIMX351AVM5B 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Multimedia Applications Processor for Automotive Products
MCIMX353CJQ4C 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:i.MX35 Applications Processors for Industrial and Consumer Products
MCIMX353CJQ5C 功能描述:处理器 - 专门应用 RINGO MX35 TO2.1 RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX353CJQ5CR2 功能描述:处理器 - 专门应用 RINGO MX35 TO2.1 RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX353CVM5B 功能描述:处理器 - 专门应用 i.MX35 Auto Apps Processor RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432