参数资料
型号: MCP14E3T-E/SN
厂商: Microchip Technology
文件页数: 18/26页
文件大小: 0K
描述: IC MOSFET DVR 4.0A DUAL 8SOIC
标准包装: 3,300
配置: 低端
输入类型: 反相
延迟时间: 46ns
电流 - 峰: 4A
配置数: 2
输出数: 2
电源电压: 4.5 V ~ 18 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
其它名称: MCP14E3T-E/SNTR
MCP14E3/MCP14E4/MCP14E5
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
b
h
h
α
A
A1
A2
φ
L
c
Units
L1
β
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
1.27 BSC
MAX
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
h
L
L1
φ
c
b
α
β
1.25
0.10
0.25
0.40
0.17
0.31
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
DS22062B-page 18
? 2008 Microchip Technology Inc.
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