参数资料
型号: MCP1826ST-0802E/DB
厂商: Microchip Technology
文件页数: 19/36页
文件大小: 0K
描述: IC REG LDO 0.8V 1A SOT223-3
产品培训模块: High Current LDOs
标准包装: 4,000
稳压器拓扑结构: 正,固定式
输出电压: 0.8V
输入电压: 2.3 V ~ 6 V
电压 - 压降(标准): 0.25V @ 1A
稳压器数量: 1
电流 - 输出: 1A(最小)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223-3
包装: 带卷 (TR)
其它名称: MCP1826ST-0802E/DBTR
MCP1826/MCP1826S
5.0
5.1
APPLICATION CIRCUITS/
ISSUES
Typical Application
In addition to the LDO pass element power dissipation,
there is power dissipation within the MCP1826/
MCP1826S as a result of quiescent or ground current.
The power dissipation as a result of the ground current
can be calculated using the following equation:
The MCP1826/MCP1826S is used for applications that
require high LDO output current and a power good
output.
EQUATION 5-2:
P I ( GND ) = V IN ( MAX ) × I VIN
Where:
O ff
On
SHDN
MCP1826-2.5
1 2 3 4 5
V OUT = 2.5V @ 1000 mA
R 1
10 k Ω C 2
10 μF
P I(GND
V IN(MAX)
=
=
Power dissipation due to the
quiescent current of the LDO
Maximum input voltage
3.3V
V IN
C 1
4.7 μF
GND
PWRGD
I VIN
=
Current flowing in the V IN pin
with no LDO output current
(LDO quiescent current)
The total power dissipated within the MCP1826/
FIGURE 5-1: Typical Application Circuit.
5.1.1 APPLICATION CONDITIONS
Package Type = TO-220-5
Input Voltage Range = 3.3V ± 5%
V IN maximum = 3.465V
V IN minimum = 3.135V
V DROPOUT (max) = 0.350V
V OUT (typical) = 2.5V
I OUT = 1000 mA maximum
P DISS (typical) = 0.965W
Temperature Rise = 28.27 ° C
MCP1826S is the sum of the power dissipated in the
LDO pass device and the P(I GND ) term. Because of the
CMOS construction, the typical I GND for the MCP1826/
MCP1826S is 120 μA. Operating at a maximum V IN of
3.465V results in a power dissipation of 0.12 milli-Watts
for a 2.5V output. For most applications, this is small
compared to the LDO pass device power dissipation
and can be neglected.
The maximum continuous operating junction
temperature specified for the MCP1826/MCP1826S is
+125 ° C . To estimate the internal junction temperature
of the MCP1826/MCP1826S, the total internal power
dissipation is multiplied by the thermal resistance from
junction to ambient (R θ JA ) of the device. The thermal
resistance from junction to ambient for the TO-220-5
package is estimated at 29.3 ° C/W.
5.2
5.2.1
Power Calculations
POWER DISSIPATION
EQUATION 5-3:
T J ( MAX ) = P TOTAL × R θ JA + T AMAX
The internal power dissipation within the MCP1826/
MCP1826S is a function of input voltage, output
voltage, output current and quiescent current.
Equation 5-1 can be used to calculate the internal
power dissipation for the LDO.
EQUATION 5-1:
P LDO = ( V IN ( MAX ) ) – V OUT ( MIN ) ) × I OUT ( MAX ) )
Where:
T J(MAX) = Maximum continuous junction
temperature
P TOTAL = Total device power dissipation
R θ JA = Thermal resistance from junction to
ambient
T AMAX = Maximum ambient temperature
P LDO
V IN(MAX)
V OUT(MIN)
=
=
=
LDO Pass device internal
power dissipation
Maximum input voltage
LDO minimum output voltage
? 2007 Microchip Technology Inc.
DS22057A-page 19
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