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| 型号： | MCP23S17T-E/SS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16 I/O, PIA-GENERAL PURPOSE, PDSO28 |
| 封装： | 5.30 MM, PLASTIC, SSOP-28 |
| 文件页数： | 20/48页 |
| 文件大小： | 915K |
| 代理商： | MCP23S17T-E/SS |
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2007 Microchip Technology Inc.
DS21952B-page 27
MCP23017/MCP23S17
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature ...............................................................................................................................-65°C to +150°C
Voltage on VDD with respect to VSS .......................................................................................................... -0.3V to +5.5V
Voltage on all other pins with respect to VSS (except VDD)............................................................. -0.6V to (VDD + 0.6V)
Total power dissipation (Note) .............................................................................................................................700 mW
Maximum current out of VSS pin ...........................................................................................................................150 mA
Maximum current into VDD pin ..............................................................................................................................125 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
...................................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
.............................................................................................................. ±20 mA
Maximum output current sunk by any output pin ....................................................................................................25 mA
Maximum output current sourced by any output pin ...............................................................................................25 mA
Note:
Power dissipation is calculated as follows:
PDIS = VDD x {IDD -
∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOL x IOL)
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested
or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., out-
side specified power supply range) and therefore outside the warranted range.
相关PDF资料 |
PDF描述 |
|---|---|
| MCP23017T-E/SO | 16 I/O, PIA-GENERAL PURPOSE, PDSO28 |
| MCP23017-E/ML | 16 I/O, PIA-GENERAL PURPOSE, PQCC28 |
| MCP23S17-E/ML | 16 I/O, PIA-GENERAL PURPOSE, PQCC28 |
| MCP23S18-E/SO | PIA-GENERAL PURPOSE, PDSO28 |
| MCP23S18T-E/SP | PIA-GENERAL PURPOSE, PDIP28 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MCP23S18 | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:16-Bit I/O Expander with Open-Drain Outputs |
| MCP23S18-E/MJ | 功能描述:接口-I/O扩展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MCP23S18-E/MJ | 制造商:Microchip Technology Inc 功能描述:; Bus Frequency:10MHz; IC Interface Type |
| MCP23S18-E/SO | 功能描述:接口-I/O扩展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MCP23S18-E/SP | 功能描述:接口-I/O扩展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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