参数资料
型号: MCP23S17T-E/SS
元件分类: 微控制器/微处理器
英文描述: 16 I/O, PIA-GENERAL PURPOSE, PDSO28
封装: 5.30 MM, PLASTIC, SSOP-28
文件页数: 33/48页
文件大小: 915K
代理商: MCP23S17T-E/SS
2007 Microchip Technology Inc.
DS21952B-page 39
MCP23017/MCP23S17
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Width
E
6.00 BSC
Exposed Pad Width
E2
3.65
3.70
4.20
Overall Length
D
6.00 BSC
Exposed Pad Length
D2
3.65
3.70
4.20
Contact Width
b
0.23
0.30
0.35
Contact Length
L
0.50
0.55
0.70
Contact-to-Exposed Pad
K
0.20
D
EXPOSED
D2
e
b
K
E2
E
L
N
NOTE 1
1
2
1
N
A
A1
A3
TOP VIEW
BOTTOM VIEW
PAD
Microchip Technology Drawing C04-105B
相关PDF资料
PDF描述
MCP23017T-E/SO 16 I/O, PIA-GENERAL PURPOSE, PDSO28
MCP23017-E/ML 16 I/O, PIA-GENERAL PURPOSE, PQCC28
MCP23S17-E/ML 16 I/O, PIA-GENERAL PURPOSE, PQCC28
MCP23S18-E/SO PIA-GENERAL PURPOSE, PDSO28
MCP23S18T-E/SP PIA-GENERAL PURPOSE, PDIP28
相关代理商/技术参数
参数描述
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MCP23S18-E/MJ 功能描述:接口-I/O扩展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel
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