参数资料
型号: MCP660T-E/ML
厂商: Microchip Technology
文件页数: 13/68页
文件大小: 0K
描述: IC OPAMP TRIPLE 60MHZ 16QFN
标准包装: 3,300
放大器类型: 通用
电路数: 3
输出类型: 满摆幅
转换速率: 32 V/µs
增益带宽积: 60MHz
电流 - 输入偏压: 6pA
电压 - 输入偏移: 1800µV
电流 - 电源: 6mA
电流 - 输出 / 通道: 80mA
电压 - 电源,单路/双路(±): 2.5 V ~ 5.5 V,±1.25 V ~ 2.75 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-VQFN 裸露焊盘
供应商设备封装: 16-QFN(4x4)
包装: 带卷 (TR)
MCP660/1/2/3/4/5/9
DS22194D-page 20
2009-2012 Microchip Technology Inc.
3.1
Analog Outputs
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs
The non-inverting and inverting inputs (VIN+, VIN-, …)
are high-impedance CMOS inputs with low bias
currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 2.5V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In that case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Chip Select Digital Input (CS)
The input (CS) is a CMOS, Schmitt-triggered input that
places the part into a Low Power mode of operation.
3.5
Exposed Thermal Pad (EP)
There is an internal connection between the exposed
thermal pad (EP) and the VSS pin; they must be con-
nected to the same potential on the printed circuit
board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
JA).
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