参数资料
| 型号： | MCZ33390EF |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 10/15页 |
| 文件大小： | 0K |
| 描述： | IC TXRX SERIAL LINK 8-SOIC |
| 标准包装： | 98 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 1/1 |
| 规程： | J-1850 |
| 电源电压： | 9 V ~ 16 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 管件 |
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33390
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VBAT DC Supply Voltage (1)
VBAT
-0.3 to 40
V
Input I/O Pins (2)
VI/O(CPU)
-0.3 to 7.0
V
BUS and LOAD Outputs
VBUS
-2.0 to 16
V
ESD Voltage (3)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-65 to 150
°C
Operating Ambient Temperature
TA
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
TPPRT
°C
Thermal Resistance (Junction-to-Ambient)
RθJ-A
180
°C/W
Notes
1.
An external series diode must be used to provide reverse battery protection of the device.
2.
SLEEP
, TX, RX, and 4X/LOOP are normally connected to a microcontroller.
3.
ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP=200 pF, RZAP=0 ).
4.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
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