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参数资料
| 型号： | MCZ33887EK |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 7/37页 |
| 文件大小： | 0K |
| 描述： | IC H-BRIDGE 5V CURR FDBK 54-SOIC |
| 标准包装： | 26 |
| 类型： | 半桥 |
| 输入类型： | 非反相 |
| 输出数： | 2 |
| 导通状态电阻： | 120 毫欧 |
| 电流 - 输出 / 通道： | 5A |
| 电流 - 峰值输出： | 6.5A |
| 电源电压： | 5 V ~ 28 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 54-SSOP（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | 54-SOICW-EP |
| 包装： | 管件 |
| 产品目录页面： | 808 (CN2011-ZH PDF) |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage (1)
V+
-0.3 to 40
V
Input Voltage
V IN
- 0.3 to 7.0
V
FS Status Output (3)
Continuous Current (4)
ESD Voltage (5)
Human Body Model
Machine Model
V FS
I OUT
V ESD1
V ESD2
-0.3 to 7.0
5.0
± 2000
± 200
V
A
V
THERMAL RATINGS
Storage Temperature
T STG
- 65 to 150
° C
Operating Temperature
Ambient
Junction
T A
T J
- 40 to 125
- 40 to 150
° C
Peak Package Reflow Temperature During Reflow
T PPRT
°C
Notes
1 Performance at voltages greater than 28V is degraded.See Electrical Performance Curves on page 18 and 19 for typical performance.
Extended operation at higher voltages has not been fully characterized and may reduce the operational lifetime.
2 Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device.
3 Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device.
4 Continuous current capability so long as junction temperature is ≤ 150 ° C.
5 ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 Ω ), ESD2 testing is performed in
accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 Ω ).
6
7
8.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
nonrepetitive excursions of junction temperature above 150 ° C can be tolerated as long as duration does not exceed 30 seconds
maximum. (nonrepetitive events are defined as not occurring more than once in 24 hours.)
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
33887
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
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