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| 型号： | MCZ33903B5EK |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 17/106页 |
| 文件大小： | 0K |
| 描述： | IC SBC CAN HS 5.0V 32SOIC |
| 标准包装： | 42 |
| 应用： | 系统基础芯片 |
| 接口： | CAN，LIN |
| 电源电压： | 5.5 V ~ 28 V |
| 封装/外壳： | 32-BSOP（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | 32-SOICW 裸露焊盘 |
| 包装： | 管件 |
| 安装类型： | 表面贴装 |
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Analog Integrated Circuit Device Data
18
Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Figure 13. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)
ESD Capability
AECQ100(11)
Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 )
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
all other Pins including CANH and CANL
Charge Device Model - JESD22/C101 (CZAP = 4.0 pF
Corner Pins (Pins 1, 16, 17, and 32)
All other Pins (Pins 2-15, 18-31)
Tested per IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 )
Device unpowered, CANH and CANL pin without capacitor, versus GND
Device unpowered, LIN, LIN1 and LIN2 pin, versus GND
Device unpowered, VS1/VS2 (100 nF to GND), versus GND
Tested per specific OEM EMC requirements for CAN and LIN with
additional capacitor on VSUP/1/2 pins (See Typical Applications on page
CANH, CANL without bus filter
LIN, LIN1 and LIN2 with and without bus filter
I/O with external components (22 k - 10 nF)
VESD1-1
VESD1-2
VESD2-1
VESD2-2
VESD3-1
VESD3-2
VESD3-3
VESD4-1
VESD4-2
VESD4-3
8000
2000
750
500
15000
9000
12000
7000
V
THERMAL RATINGS
Junction temperature
TJ
150
°C
Ambient temperature
TA
-40 to 125
°C
Storage temperature
TST
-50 to 150
°C
THERMAL RESISTANCE
Thermal resistance junction to ambient(14)
RJA
50(14)
°C/W
Peak package reflow temperature during reflow(12), (13)
TPPRT
°C
Notes
11.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500 ), the Charge Device Model
(CDM), and Robotic (CZAP = 4.0 pF).
12.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
14.
This parameter was measured according to Figure 13:
Table 5. Maximum Ratings (continued)
All voltages are referenced to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit
PCB 100mm x 100mm
Bottom side
20mm x 40mm
Top side, 300 sq. mm
(20mmx15mm)
Bottom view
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCZ33903B5EKR2 | 功能描述:CAN 接口集成电路 SBC W/HIGH SPEED CAN 5V RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MCZ33903B5R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:SBC Gen2 with CAN High Speed and LIN Interface |
| MCZ33903BD3EK | 功能描述:CAN 接口集成电路 Canvas 32 DL (3.3V) RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MCZ33903BD3EKR2 | 功能描述:CAN 接口集成电路 Canvas 32 DL (3.3V) RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MCZ33903BD3R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:SBC Gen2 with CAN High Speed and LIN Interface |
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