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参数资料
| 型号： | MIP7365-450F24M |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 450 MHz, MICROPROCESSOR, CQFP208 |
| 封装： | 1.20 X 1.20 MM, CERAMIC, QFP-208 |
| 文件页数： | 4/16页 |
| 文件大小： | 285K |
| 代理商： | MIP7365-450F24M |
12
SCD7365 Rev B 1/11/07
Aeroflex Plainview
MIP7365 216-PIN EPad LQFP PACKAGE OUTLINE
Molded depression in
plastic - do not solder
EXPOSED PAD OPTION
The solderable exposed pad must be
connected to ground on the PCB
6.6(.260)
6.0(.236)
26.20(1.031)
25.80(1.015)
4
24.20(.953)
23.80(.937)
12.10(.476)
11.90(.485)
12.10(.476)
11.90(.485)
-E-
-A-
7
3
1
216
PIN #1 ID
-D-
24.20(.953)
23.80(.937)
26.20(1.031)
25.80(1.015)
4
-D- 3
-B-
3
4X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
DATUM PLANE
0.25(.010)
0.15(.006)
0.05(.002)
SEATING PLANE
BASE PLANE
-C-
DETAIL "B"
DETAIL "A"
DETAIL "C"
GAGE PLANE
0°~7°
1.00(.039) REF.
0.75(.029)
0.45(.018)
0.20(.008)MIN
-H-
2
0.08(.003)
0.20(.008)
R0.08(.003)
MIN. TYP.
MIN 0°
R
0.08(.003) C
0.40(.0157) BSC.
12° TYP.
0.20(.008)
0.10(.004)
AFTER PLATING
0.09/0.20
0.09/0.16
0.13/0.23
0.13/0.18
0.20(.008)
DETAIL "A"
DETAIL "B"
1.60(.063) MAX.
1.45(.057)
1.35(.053)
- 0.05 S
M
0.07(.003)
SD
C
A-B
S
XX
Y
C
N
U
O
R
T
SEE DETAIL "C"
(EXPOSED PAD CORNER DETAIL)
TYP.
(0.35)
TYP.
(0.35)
0.20 BSC
0.30 MAX.
5
15
13.10(.516)
12.90(.508)
13.10(.516)
12.90(.508)
-A,B, or D -
3
7
8
5
7
5
7
5
BASE METAL
WITH LEAD FINISH
9
0.05
8
13
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