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参数资料
| 型号： | MIP7365-450F24M |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 450 MHz, MICROPROCESSOR, CQFP208 |
| 封装： | 1.20 X 1.20 MM, CERAMIC, QFP-208 |
| 文件页数： | 7/16页 |
| 文件大小： | 285K |
| 代理商： | MIP7365-450F24M |
15
SCD7365 Rev B 1/11/07
Aeroflex Plainview
MIP7365 216-EPad LQFP NUMERICAL PINOUT vs FUNCTION 1, 2 CON’T
PIN
FUNCTION
PIN
FUNCTION
153
SysAD4
191
VccIO
154
VccInt
192
SysADC7
155
Do Not Connect
193
SysADC3
156
Do Not Connect
194
VccInt
157
VccInt
195
SysADC6
158
Do Not Connect
196
VccIO
159
Do Not Connect
197
SysADC2
160
Do Not Connect
198
SysAD63
161
Do Not Connect
199
SysAD31
162
VccIO
200
Do Not Connect
163
Do Not Connect
201
SysAD62
164
VccIO
202
SysAD30
165
VccIO
203
VccIO
166
Do Not Connect
204
VccIO
167
Do Not Connect
205
VccInt
168
Do Not Connect
206
SysAD61
169
Do Not Connect
207
SysAD29
170
SysAD35
208
VccInt
171
SysAD3
209
SysAD60
172
VccInt
210
SysAD28
173
SysAD34
211
Do Not Connect
174
SysAD2
212
Do Not Connect
175
VccInt
213
Do Not Connect
176
VccIO
214
Do Not Connect
177
VccInt
215
VccIO
178
SysAD33
216
VccIO
179
SysAD1
180
SysAD32
181
SysAD0
182
SysADC5
183
SysADC1
184
VccIO
185
VccInt
186
SysADC4
187
SysADC0
188
Do Not Connect
189
VccInt
190
VccIO
Notes:
1. The exposed pad on the bottom of the EPad LQFP package
acts as the sole device ground and as the primary heat
conduction path. As such, it must be soldered to the printed
circuit board.
2. See PMC-2030256, 216-EPad LQFP Design Guidelines
Application Note for details.
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