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| 型号： | MM908E622ACDWB/R2 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54 |
| 封装： | 17.90 X 7.50 MM, 0.65 MM PITCH, PLASTIC, SOIC-54 |
| 文件页数： | 59/66页 |
| 文件大小： | 1277K |
| 代理商： | MM908E622ACDWB/R2 |
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Analog Integrated Circuit Device Data
62
Freescale Semiconductor
908E622
ADDITIONAL INFORMATION
THERMAL ADDENDUM
ADDITIONAL INFORMATION
THERMAL ADDENDUM
INTEGRATED QUAD H-BRIDGE, TRIPLE HIGH-SIDE AND EC
GLASS DRIVER WITH EMBEDDED MCU AND LIN FOR MIRROR
Thermal Addendum
Introduction
This thermal addendum ia provided as a supplement to the MM908E622
technical data sheet. The addendum provides thermal performance information
that may be critical in the design and development of system applications. All
electrical, application and packaging information is provided in the data sheet.
Package and Thermal Considerations
This MM908E622 is a dual die package. There are two heat sources in the
package independently heating with P1 and P2. This results in two junction
temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn.
For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the reference
temperature while only heat source 1 is heating with P1.
For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the
reference temperature while heat source 2 is heating with P2. This applies to
RθJ21 and RθJ22, respectively.
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
54-PIN
SOICW-EP
908E622
DWB SUFFIX
98ARL105910
54-PIN SOICW-EP
Note For package dimensions, refer to the
908E622 device datasheet.
TJ1
TJ2
=
RθJA11
RθJA21
RθJA12
RθJA22
.
P1
P2
Standards
Figure 36. Thermal Land Pattern for Direct Thermal
Attachment Per JEDEC JESD51-5
Table 24. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip
[
°C/W]
m
= 1,
n
= 1
m
= 1, n = 2
m
= 2, n = 1
m
= 2,
n
= 2
RθJAmn
23
20
24
RθJBmn
9.0
6.0
10
RθJAmn
52
47
52
RθJCmn (5)
1.0
0
2.0
Notes
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
4.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.
Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
1.0
0.2
Soldermast
openings
Thermal vias
connected to top
buried plane
54 Terminal SOIC-EP
0.65 mm Pitch
17.9 mm x 7.5 mm Body
10.3 mm x 5.1 mm Exposed Pad
* All measurements
are in millimeters
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MM908E622ACEK | 功能描述:8位微控制器 -MCU QUAD H-B TRIHS EC GLASS RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MM908E622ACPEK | 功能描述:IC QUAD HALF BRDG TRPL SW 54SOIC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器 - 特定应用 系列:- 产品变化通告:Product Discontinuation 26/Aug/2009 标准包装:250 系列:- 应用:网络处理器 核心处理器:4Kc 程序存储器类型:- 控制器系列:- RAM 容量:16K x 8 接口:以太网，UART，USB 输入/输出数:- 电源电压:1.8V, 3.3V 工作温度:- 安装类型:表面贴装 封装/外壳:208-LQFP 包装:带卷 (TR) 供应商设备封装:PG-LQFP-208 其它名称:SP000314382 |
| MM908E622ACPEKR2 | 功能描述:8位微控制器 -MCU QUAD H-B, TRIHS, EC RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MM908E624 | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:TRIPLE HIGH-SIDE SWITCH WITH EMBEDDED MCU AND LIN |
| MM908E624ACDWB | 功能描述:IC TRPL SWITCH MCU/LIN 54-SOIC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器 - 特定应用 系列:- 产品变化通告:Product Discontinuation 26/Aug/2009 标准包装:250 系列:- 应用:网络处理器 核心处理器:4Kc 程序存储器类型:- 控制器系列:- RAM 容量:16K x 8 接口:以太网，UART，USB 输入/输出数:- 电源电压:1.8V, 3.3V 工作温度:- 安装类型:表面贴装 封装/外壳:208-LQFP 包装:带卷 (TR) 供应商设备封装:PG-LQFP-208 其它名称:SP000314382 |
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