参数资料
型号: MMDF2C03HDR2G
厂商: ON Semiconductor
文件页数: 7/10页
文件大小: 0K
描述: MOSFET N/P-CHAN 2A 30V 8SOIC
产品变化通告: Product Obsolescence 14/Apr/2010
产品目录绘图: MOSFET 8-SOIC
标准包装: 10
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 4.1A,3A
开态Rds(最大)@ Id, Vgs @ 25° C: 70 毫欧 @ 3A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 16nC @ 10V
输入电容 (Ciss) @ Vds: 630pF @ 24V
功率 - 最大: 2W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 标准包装
其它名称: MMDF2C03HDR2GOSDKR
MMDF2C03HD
DRAIN ? TO ? SOURCE DIODE CHARACTERISTICS
The switching characteristics of a MOSFET body diode
are very important in systems using it as a freewheeling or
commutating diode. Of particular interest are the reverse
recovery characteristics which play a major role in
determining switching losses, radiated noise, EMI and RFI.
System switching losses are largely due to the nature of
the body diode itself. The body diode is a minority carrier
device, therefore it has a finite reverse recovery time, t rr , due
to the storage of minority carrier charge, Q RR , as shown in
the typical reverse recovery wave form of Figure 15. It is this
stored charge that, when cleared from the diode, passes
through a potential and defines an energy loss. Obviously,
repeatedly forcing the diode through reverse recovery
further increases switching losses. Therefore, one would
like a diode with short t rr and low Q RR specifications to
minimize these losses.
The abruptness of diode reverse recovery effects the
amount of radiated noise, voltage spikes, and current
ringing. The mechanisms at work are finite irremovable
circuit parasitic inductances and capacitances acted upon by
N ? Channel
3.0
high di/dts. The diode’s negative di/dt during t a is directly
controlled by the device clearing the stored charge.
However, the positive di/dt during t b is an uncontrollable
diode characteristic and is usually the culprit that induces
current ringing. Therefore, when comparing diodes, the
ratio of t b /t a serves as a good indicator of recovery
abruptness and thus gives a comparative estimate of
probable noise generated. A ratio of 1 is considered ideal and
values less than 0.5 are considered snappy.
Compared to ON Semiconductor standard cell density
low voltage MOSFETs, high cell density MOSFET diodes
are faster (shorter t rr ), have less stored charge and a softer
reverse recovery characteristic. The softness advantage of
the high cell density diode means they can be forced through
reverse recovery at a higher di/dt than a standard cell
MOSFET diode without increasing the current ringing or the
noise generated. In addition, power dissipation incurred
from switching the diode will be less due to the shorter
recovery time and lower switching losses.
P ? Channel
2
2.5
T J = 25 ° C
V GS = 0 V
1.6
T J = 25 ° C
V GS = 0 V
2.0
1.2
1.5
0.8
1.0
0.5
0.4
0
0.5
0.55
0.6
0.65
0.7
0.75
0.8
0.85
0
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
V SD , SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
V SD , SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
http://onsemi.com
7
相关PDF资料
PDF描述
MMDF2N02ER2G MOSFET N-CHAN DUAL 2A 25V 8SOIC
MMDF2P02ER2G MOSFET PWR P-CH 25V 2.5A 8-SOIC
MMDF2P02HDR2G MOSFET P-CH DUAL 3.3A 20V 8SOIC
MMDF3N02HDR2G MOSFET PWR P-CH 20V 3.8A 8-SOIC
MMDF3N04HDR2G MOSFET N-CH DUAL 3.4A 40V 8SOIC
相关代理商/技术参数
参数描述
MMDF2C03HDR2G 制造商:ON Semiconductor 功能描述:MOSFET
MMDF2N02E 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 2 Amps, 25 Volts N−Channel SO−8, Dual
MMDF2N02ER2 功能描述:MOSFET 25V 2A N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
MMDF2N02ER2G 功能描述:MOSFET NFET SO8D 25V 3.6A 100mOhm RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
MMDF2N05ZR2 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述: 制造商:ON Semiconductor 功能描述: